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1. WO2022208917 - LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING DISPLAY DEVICE, METHOD FOR MANUFACTURING QUANTUM DOT COLLOIDAL SOLUTION, AND QUANTUM DOT COLLOIDAL SOLUTION

Publication Number WO/2022/208917
Publication Date 06.10.2022
International Application No. PCT/JP2021/024286
International Filing Date 28.06.2021
IPC
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H05B 33/10 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H05B 33/12 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
H01L 51/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H05B 33/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
14characterised by the chemical or physical composition or the arrangement of the electroluminescent material
H05B 33/22 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
22characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
CPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
H05B 33/10
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H05B 33/12
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
H05B 33/14
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
14characterised by the chemical or physical composition or the arrangement of the electroluminescent material ; , or by the simultaneous addition of the electroluminescent material in or onto the light source
H05B 33/22
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
22characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 上田 吉裕 UETA, Yoshihiro
  • 浅岡 康 ASAOKA, Yasushi
  • 矢口 裕真 YAGUCHI, Yuma
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
PCT/JP2021/01345730.03.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING DISPLAY DEVICE, METHOD FOR MANUFACTURING QUANTUM DOT COLLOIDAL SOLUTION, AND QUANTUM DOT COLLOIDAL SOLUTION
(FR) ÉLÉMENTS LUMINESCENTS AINSI QUE PROCÉDÉ DE FABRICATION DE CEUX-CI, DISPOSITIF D'AFFICHAGE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, ET SOLUTION COLLOÏDALE DE POINTS QUANTIQUES AINSI QUE PROCÉDÉ DE FABRICATION DE CELLE-CI
(JA) 発光素子、表示デバイス、発光素子の製造方法、表示デバイスの製造方法、量子ドットコロイド溶液の製造方法、及び、量子ドットコロイド溶液
Abstract
(EN) In the present invention, light-emitting elements (6R, 6G, 6B) comprise an anode (10), a light-emitting layer (14), and a cathode (18) arranged in the stated order. The light-emitting layer includes a plurality of quantum dots (26B) and an insulating material (28). The average value of a gap (14DA) between a quantum dot in an anode-side end surface part (14BA) of the light-emitting layer and an anode-side end surface (14EA) of the light-emitting layer is less than the average value of a gap (14DC) between a quantum dot in a cathode-side end surface part (14BC) of the light-emitting layer and a cathode-side end surface (14EC) of the light-emitting layer. Additionally, a display device (2) is provided with a bank 20 that divides the light-emitting elements into sub-pixels (SPR, SPG, SPB). The light-emitting layer includes: a main light-emitting part that includes a light-emitting material; and an outer edge part that, in a plan view of a substrate (4), is arranged at a position surrounding the main light-emitting region, and that includes a deactivation material in which the light-emitting material is deactivated. The bank has a forward-tapered surface (20S) at a side surface thereof, and contacts the outer edge part at the forward tapered surface.
(FR) Selon l'invention, des éléments luminescents (6R, 6G, 6B) sont équipés d'une anode (10), d'une couche luminescente (14) et d'une cathode (18) disposées dans cet ordre. La couche luminescente contient une pluralité de points quantiques (26B) et un matériau isolant (28). La valeur moyenne de l'écartement (14DA) entre les points quantiques au niveau d'une partie face extrémité (14BA) côté anode de la couche luminescente, et une face extrémité (14EA) côté anode de la couche luminescente, est inférieure à la valeur moyenne de l'écartement (14DC) entre les points quantiques au niveau d'une partie face extrémité (14BC) côté cathode de la couche luminescente, et une face extrémité (14EC) côté cathode de la couche luminescente. En outre, selon l'invention, un dispositif d'affichage (2) est équipé d'un bloc (20) dans lequel les éléments luminescents sont chacun divisés en sous-pixels (SPR, SPG, SPB). La couche luminescente contient : une partie luminescente principale contenant un matériau luminescent ; et une partie bord externe qui, selon une vue en plan d'un substrat (4), est disposée en une position entourant une région luminescente principale, et contient un matériau de désactivation désactivant le matériau luminescent. Le bloc possède une face fuselée vers l'avant (20s) au niveau d'une face latérale, et vient en contact avec la partie bord externe au niveau de cette face fuselée vers l'avant.
(JA) 発光素子(6R、6G、6B)は、アノード(10)と、発光層(14)と、カソード(18)とを、この順に配置して備える。発光層は、複数の量子ドット(26B)と、絶縁材(28)とを含む。発光層のアノードの側の端面部(14BA)における量子ドットと、発光層のアノードの側の端面(14EA)との間隔(14DA)の平均値は、発光層のカソードの側の端面部(14BC)における量子ドットと、発光層のカソードの側の端面(14EC)との間隔(14DC)の平均値よりも小さい。また、表示デバイス(2)は、発光素子をサブ画素(SPR、SPG、SPB)ごとに区画するバンク20を備える。発光層は、発光材料を含む主発光部と、基板(4)の平面視において、主発光領域を囲う位置に配置され、かつ、発光材料が失活した失活材料を含む外縁部とを含む。バンクは、側面に順テーパー面(20S)を有し、該順テーパー面において、外縁部と接する。
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