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1. WO2022207497 - INTEGRATED CIRCUIT TESTING

Publication Number WO/2022/207497
Publication Date 06.10.2022
International Application No. PCT/EP2022/057951
International Filing Date 25.03.2022
IPC
G01R 31/28 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 31/30 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
30Marginal testing, e.g. by varying supply voltage
G01R 31/317 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
317Testing of digital circuits
CPC
G01R 31/2853
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
G01R 31/2856
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2855Environmental, reliability or burn-in testing
2856Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
G01R 31/2884
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2884using dedicated test connectors, test elements or test circuits on the IC under test
G01R 31/30
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
30Marginal testing, e.g. by varying supply voltage
G01R 31/31715
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
317Testing of digital circuits
31712Input or output aspects
31715Testing of input or output circuits; test of circuitry between the I/C pins and the functional core, e.g. testing of input or output driver, receiver, buffer
G01R 31/31717
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
317Testing of digital circuits
31712Input or output aspects
31717Interconnect testing
Applicants
  • TOUCHNETIX AS [NO]/[NO]
Inventors
  • MYREN, Steinar
Agents
  • BICKER, Martin
Priority Data
2104407.829.03.2021GB
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) INTEGRATED CIRCUIT TESTING
(FR) TEST DE CIRCUIT INTÉGRÉ
Abstract
(EN) Described is a method for connectivity testing of integrated circuits. The method includes connecting an integrated circuit comprising an internal measurement component and a plurality of connection elements to an automated testing apparatus via a first common test channel connected to a first set of non-neighbouring connection elements of the plurality of connection elements and a second common test channel connected to a second set of non-neighbouring connection elements of the plurality of connection elements, different to the first set of non-neighbouring connection elements. The connection elements of the first set of non-neighbouring connection elements neighbour connection elements of the second set of non-neighbouring connection elements. The method further includes connecting a connection element of the plurality of connection elements to the internal measurement component, testing the connected connection element, and identifying a pass or fail for the connected connection element based on the testing. Also described is a system for connectivity testing of integrated circuits, and an adaptor for use with an system for connectivity testing of integrated circuits.
(FR) L'invention concerne un procédé de test de connectivité de circuits intégrés. Le procédé comprend la connexion d'un circuit intégré comprenant un composant de mesure interne et une pluralité d'éléments de connexion à un appareil de test automatisé par le biais d'un premier canal de test commun connecté à un premier ensemble d'éléments de connexion non adjacents de la pluralité d'éléments de connexion et d'un second canal de test commun connecté à un second ensemble d'éléments de connexion non adjacents de la pluralité d'éléments de connexion, différent du premier ensemble d'éléments de connexion non adjacents. Les éléments de connexion du premier ensemble d'éléments de connexion non adjacents jouxtent les éléments de connexion du second ensemble d'éléments de connexion non adjacents. Le procédé comprend en outre la connexion d'un élément de connexion de la pluralité d'éléments de connexion au composant de mesure interne, le test de l'élément de connexion connecté, et l'identification d'un succès ou d'un échec pour l'élément de connexion connecté sur la base du test. L'invention concerne également un système de test de connectivité de circuits intégrés, et un adaptateur à utiliser avec un système de test de connectivité de circuits intégrés.
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