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1. WO2022163610 - PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER

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Publication Number WO/2022/163610
Publication Date 04.08.2022
International Application No. PCT/JP2022/002548
International Filing Date 25.01.2022
IPC
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/025 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
G03F 7/037 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
H05K 3/28 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/025
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 東レ株式会社 TORAY INDUSTRIES, INC. [JP]/[JP]
Inventors
  • 桂田悠基 KATSURADA, Yuki
  • 小林悠太 KOBAYASHI, Yuta
  • 金森大典 KANAMORI, Daisuke
Priority Data
2021-01411201.02.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FEUILLE DE RÉSINE PHOTOSENSIBLE, PRODUIT DURCI, STRUCTURE CREUSE, COMPOSANT ÉLECTRONIQUE ET FILTRE À ONDES ÉLASTIQUES
(JA) 感光性樹脂組成物、感光性樹脂シート、硬化物、中空構造体、電子部品および弾性波フィルター
Abstract
(EN) The purpose of the present invention is to provide a photosensitive resin composition having excellent pattern processability and pressure resistance. The present invention is a photosensitive resin composition comprising (A) a polymer, (B) a radically polymerizable compound, (C) a photopolymerization initiator, and (D) an inorganic filler, wherein the radically polymerizable functional group equivalent of the (B) radically polymerizable compound is 70-200 g/eq on average.
(FR) Le but de la présente invention est de fournir une composition de résine photosensible ayant une excellente aptitude au traitement de motifs et une excellente résistance à la pression. La présente invention concerne une composition de résine photosensible comprenant (A) un polymère, (B) un composé polymérisable par voie radicalaire, (C) un initiateur de photopolymérisation, et (D) une charge inorganique, l'équivalent en groupe fonctionnel polymérisable par voie radicalaire du (B) composé polymérisable par voie radicalaire étant en moyenne de 70 à 200 g/éq.
(JA) 本発明の目的は、パターン加工性および耐圧性に優れた感光性樹脂組成物を提供することである。本発明は、（Ａ）ポリマー、（Ｂ）ラジカル重合性化合物、（Ｃ）光重合開始剤、及び（Ｄ）無機フィラーを含む感光性樹脂組成物であって、前記（Ｂ）ラジカル重合性化合物のラジカル重合性官能基当量が、平均で７０ｇ／ｅｑ以上２００ｇ／ｅｑ以下である、感光性樹脂組成物である。
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