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1. WO2022163062 - CLEANING MECHANISM, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE

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Publication Number WO/2022/163062
Publication Date 04.08.2022
International Application No. PCT/JP2021/041283
International Filing Date 10.11.2021
IPC
B29C 33/72 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
70Maintenance
72Cleaning
B29C 45/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
H01L 21/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
B29C 33/72
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
70Maintenance
72Cleaning
B29C 45/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
Applicants
  • ＴＯＷＡ株式会社 TOWA CORPORATION [JP]/[JP]
Inventors
  • 藤原　智人 FUJIWARA,Tomohito
Agents
  • 弁理士法人ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE
Priority Data
2021-00995426.01.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CLEANING MECHANISM, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
(FR) MÉCANISME DE NETTOYAGE, DISPOSITIF DE MOULAGE DE RÉSINE ET MÉTHODE DE FABRICATION D'UN ARTICLE MOULÉ EN RÉSINE
(JA) クリーニング機構、樹脂成形装置及び樹脂成形品の製造方法
front page image
Abstract
(EN) A technique for extending the life of a brush is provided. This cleaning mechanism 3 is provided with a brush 31 which can clean by moving in contact with a molding die 6, and is configured to be able to change the movement speed of the brush 31 depending on the surface shape of the molding die 6.
(FR) L'invention concerne une technique pour prolonger la durée de vie d'une brosse. Ce mécanisme de nettoyage (3) est pourvu d'une brosse (31) qui peut nettoyer en se déplaçant en contact avec une matrice de moulage (6), et est configuré pour pouvoir modifier la vitesse de déplacement de la brosse (31) en fonction de la forme de surface de la matrice de moulage (6).
(JA) ブラシの寿命を長くする技術を提供する。本発明のクリーニング機構３は、成形型６に接触して移動することでクリーニング可能なブラシ３１を備え、前記成形型６の表面形状に応じて前記ブラシ３１の移動速度を変更可能に構成されている。
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