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1. WO2022163042 - SAMPLE PIECE RELOCATING DEVICE

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Publication Number WO/2022/163042
Publication Date 04.08.2022
International Application No. PCT/JP2021/039006
International Filing Date 21.10.2021
IPC
H01L 21/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
G01N 1/28 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1Sampling; Preparing specimens for investigation
28Preparing specimens for investigation
G01N 1/32 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1Sampling; Preparing specimens for investigation
28Preparing specimens for investigation
32Polishing; Etching
CPC
G01N 1/28
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1Sampling; Preparing specimens for investigation
28Preparing specimens for investigation ; including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
G01N 1/32
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1Sampling; Preparing specimens for investigation
28Preparing specimens for investigation ; including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
32Polishing; Etching
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applicants
  • 株式会社日立ハイテクサイエンス HITACHI HIGH-TECH SCIENCE CORPORATION [JP]/[JP]
Inventors
  • 麻畑　達也 ASAHATA Tatsuya
Agents
  • 田▲崎▼　聡 TAZAKI Akira
  • 鈴木　慎吾 SUZUKI Shingo
  • 西澤　和純 NISHIZAWA Kazuyoshi
  • 小林　淳一 KOBAYASHI Junichi
Priority Data
2021-01269329.01.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SAMPLE PIECE RELOCATING DEVICE
(FR) DISPOSITIF DE RELOCALISATION DE PIÈCE D'ÉCHANTILLON
(JA) 試料片移設装置
front page image
Abstract
(EN) This sample piece relocating device (10) comprises an optical interferometry device (11), a sample piece carrying device (13) and a control device (21). The control device (21) controls the sample piece carrying device (13) on the basis of information related to a process in which a charged-particle beam device is used to irradiate a sample (S) with a charged-particle beam, thereby preparing a sample piece. The sample piece carrying device (13) controlled by the control device (21) separates and extracts the sample piece from the sample (S) and holds and carries the sample piece to a sample piece holder.
(FR) L'invention concerne un dispositif de relocalisation de pièce d'échantillon (10) comprenant un dispositif d'interférométrie optique (11), un dispositif de transport de pièce d'échantillon (13) et un dispositif de commande (21). Le dispositif de commande (21) commande le dispositif de transport de pièce d'échantillon (13) sur la base d'informations relatives à un processus dans lequel un dispositif à faisceau de particules chargées est utilisé pour irradier un échantillon (S) avec un faisceau de particules chargées, ce qui permet de préparer une pièce d'échantillon. Le dispositif de transport de pièce d'échantillon (13) commandé par le dispositif de commande (21) sépare et extrait la pièce d'échantillon de l'échantillon (S) et maintient et transporte la pièce d'échantillon vers un support de pièce d'échantillon.
(JA) 試料片移設装置（１０）は、光干渉計測装置（１１）と、試料片搬送装置（１３）と、制御装置（２１）とを備える。制御装置（２１）は、荷電粒子ビーム装置によって荷電粒子ビームを試料（Ｓ）に照射することによって試料片を作製する加工に関する情報に基づき、試料片搬送装置（１３）を制御する。制御装置（２１）によって制御される試料片搬送装置（１３）は、試料片を試料（Ｓ）から分離及び摘出して、試料片を保持して試料片ホルダに搬送する。
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