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1. WO2022162174 - HYBRID DATACENTRE MODULE

Publication Number WO/2022/162174
Publication Date 04.08.2022
International Application No. PCT/EP2022/052101
International Filing Date 28.01.2022
IPC
H05K 7/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/1497
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
1485Servers; Data center rooms, e.g. 19-inch computer racks
1497Rooms for data centers; Shipping containers therefor
H05K 7/20745
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20718Forced ventilation of a gaseous coolant
20745within rooms for removing heat from cabinets, e.g. by air conditioning device
H05K 7/2079
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
2079within rooms for removing heat from cabinets
Applicants
  • SOLO30 B.V. [NL]/[NL]
Inventors
  • VERZIJL, Marco Hendricus Cornelis
  • VAN SMAALEN, Willem
  • LAKEMAN, Jorge
  • AMZARAKOV, Maxim
  • LODDER, Robbert Mees
Agents
  • EP&C
Priority Data
202746029.01.2021NL
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) HYBRID DATACENTRE MODULE
(FR) MODULE DE CENTRE DE DONNÉES HYBRIDE
Abstract
(EN) The present invention relates to a hybrid datacentre module, comprising a server housing, one or more server modules arranged in an interior of the server housing, and a cooling device, configured to dissipate heat generated by the server modules out of the server housing. The server housing comprises one or more server racks and the one or more server modules comprise one or more air-cooled server modules arranged in the one or more server racks. The cooling device is connected to the server housing and configured to guide a flow of cooling fluid, and the cooling device is configured to pump the cooling fluid into, and to extract the cooling fluid from the server housing. The one or more server modules further comprise one or more immersion-cooled server modules. The datacentre module further comprises a wired data transfer connection between the air-cooled server modules and immersion-cooled server modules. The cooling device is further connected to the immersion-cooled server modules, and the cooling device is further configured to pump the cooling fluid from the server housing into, and to extract the cooling fluid from the immersion-cooled server modules.
(FR) La présente invention concerne un module de centre de données hybride, comprenant un boîtier de serveurs, un ou plusieurs modules serveurs disposés à l'intérieur du boîtier de serveurs, et un dispositif de refroidissement, conçu pour dissiper la chaleur générée par les modules serveurs hors du boîtier de serveurs. Le boîtier de serveurs comprend un ou plusieurs bâtis de serveur et le ou les modules serveurs comprennent un ou plusieurs modules serveurs refroidis par air disposés dans le ou les bâtis de serveur. Le dispositif de refroidissement est relié au boîtier de serveurs et est conçu pour guider un écoulement de fluide de refroidissement, et le dispositif de refroidissement est conçu pour pomper le fluide de refroidissement dans le boîtier de serveurs et pour l'en extraire. Le ou les modules serveurs comprennent en outre un ou plusieurs modules serveurs refroidis par immersion. Le module de centre de données comprend en outre une connexion de transfert de données câblée entre les modules serveurs refroidis par air et les modules serveurs refroidis par immersion. Le dispositif de refroidissement est en outre relié aux modules serveurs refroidis par immersion, et le dispositif de refroidissement est en outre conçu pour pomper le fluide de refroidissement en entrée à partir du boîtier de serveurs et pour extraire le fluide de refroidissement des modules serveurs refroidis par immersion.
Latest bibliographic data on file with the International Bureau