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1. WO2022160146 - MASK AND MANUFACTURING METHOD THEREFOR, AND MASK ASSEMBLY

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Publication Number WO/2022/160146
Publication Date 04.08.2022
International Application No. PCT/CN2021/074045
International Filing Date 28.01.2021
IPC
C23C 14/04 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
G03F 1/64 2012.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
62Pellicles or pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
64characterised by the frames, e.g. structure or material thereof
H01L 51/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
C23C 14/04
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
G03F 1/64
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
1Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
64characterised by the frames, e.g. structure or material, including bonding means therefor
H10K 59/00
H10K 71/00
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 毕娜 BI, Na
Agents
  • 北京安信方达知识产权代理有限公司 AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MASK AND MANUFACTURING METHOD THEREFOR, AND MASK ASSEMBLY
(FR) MASQUE ET SON PROCÉDÉ DE FABRICATION, ET ENSEMBLE MASQUE
(ZH) 掩膜版及其制备方法、掩膜版组件
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Abstract
(EN) A mask and a manufacturing method therefor, and a mask assembly. The mask comprises a display region and welding regions located at the opposite two sides of the display region in a first direction; each welding region at least comprises a thickening portion; a set welding region is provided on the thickening portion; the thickness of the set welding region is greater than the thickness of the display region; and the thickening portion protrudes out of the surface of at least one side of the display region in the horizontal direction of the display region.
(FR) Masque et son procédé de fabrication, et ensemble masque. Le masque comprend une région d'affichage et des régions de soudage situées sur les deux côtés opposés de la région d'affichage dans une première direction ; chaque région de soudage comprenant au moins une partie d'épaississement ; une région de soudage définie est disposée sur la partie d'épaississement ; l'épaisseur de la région de soudage définie est supérieure à l'épaisseur de la région d'affichage ; et la partie d'épaississement fait saillie hors de la surface d'au moins un côté de la région d'affichage dans la direction horizontale de la région d'affichage.
(ZH) 一种掩膜版及其制备方法、掩膜版组件。掩膜版包括显示区以及位于所述显示区第一方向相对两侧的焊接区，所述焊接区至少包括加厚部，所述加厚部上设置有设定焊接区，所述设定焊接区的厚度大于所述显示区的厚度，在所述显示区的水平方向上，所述加厚部凸出所述显示区至少一侧的表面。
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