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1. WO2022092505 - APPARATUS AND METHOD FOR NON-DESTRUCTIVE INSPECTION OF DEFECTS INSIDE HIGH-FREQUENCY HEAT-TREATED METAL USING NON-CONTACT PHOTOACOUSTIC IMAGES

Publication Number WO/2022/092505
Publication Date 05.05.2022
International Application No. PCT/KR2021/010715
International Filing Date 12.08.2021
IPC
G01N 29/24 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details
24Probes
G01N 29/44 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
44Processing the detected response signal
G01N 29/38 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
36Detecting the response signal
38by time filtering, e.g. using time gates
G01N 21/17 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
CPC
G01N 21/1702
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
17Systems in which incident light is modified in accordance with the properties of the material investigated
1702with opto-acoustic detection, e.g. for gases or analysing solids
G01N 2291/0234
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2291Indexing codes associated with group G01N29/00
02Indexing codes associated with the analysed material
023Solids
0234Metals, e.g. steel
G01N 2291/103
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
2291Indexing codes associated with group G01N29/00
10Number of transducers
103one emitter, two or more receivers
G01N 29/2418
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22Details ; , e.g. general constructional or apparatus details
24Probes
2418using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
G01N 29/38
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
36Detecting the response signal ; , e.g. electronic circuits specially adapted therefor
38by time filtering, e.g. using time gates
G01N 29/4445
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
44Processing the detected response signal ; , e.g. electronic circuits specially adapted therefor
4445Classification of defects
Applicants
  • 이현철 LEE, Hyun Cheol [KR]/[KR]
Inventors
  • 이현철 LEE, Hyun Cheol
Agents
  • 오위환 OH, Wihwan
Priority Data
10-2020-013941326.10.2020KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) APPARATUS AND METHOD FOR NON-DESTRUCTIVE INSPECTION OF DEFECTS INSIDE HIGH-FREQUENCY HEAT-TREATED METAL USING NON-CONTACT PHOTOACOUSTIC IMAGES
(FR) APPAREIL ET PROCÉDÉ DE CONTRÔLE NON DESTRUCTIF DES DÉFAUTS À L'INTÉRIEUR D'UN MÉTAL TRAITÉ THERMIQUEMENT À HAUTE FRÉQUENCE UTILISANT DES IMAGES PHOTOACOUSTIQUES SANS CONTACT
(KO) 비접촉 광음향 영상을 이용한 고주파 열처리 금속 내부의 비파괴 결함 검사 장치 및 방법
Abstract
(EN) The present invention relates to an apparatus and method for the non-destructive inspection of defects inside a high-frequency heat-treated metal using non-contact photoacoustic images, wherein inspection efficiency and accuracy are improved by detecting defects by acquiring photoacoustic images of high-frequency heat-treated parts. The apparatus comprises: a non-contact photoacoustic signal measurement unit including a light emission unit, which has a nanosecond pulse laser for generating photoacoustic signals, and an optical measurement unit, which has a continues wave (CW) laser, an optical interferometer, and a signal acquisition module, and measures the photoacoustic signals that are generated when the nanosecond pulse laser is emitted from the light emission unit to a measurement target; a defect location detection unit which calculates a photoacoustic wave propagation time using the photoacoustic signal measurement results of the non-contact photoacoustic signal measurement unit, and detects the locations of defects by calculating the size of photoacoustic waves generated at arbitrary locations; and a defect location imaging unit which presents the detection results of the defect location detection unit as a three-dimensional image, and presents the location and size information of the defects in image form.
(FR) La présente invention concerne un appareil et un procédé de contrôle non destructif des défauts à l'intérieur d'un métal traité thermiquement à haute fréquence utilisant des images photoacoustiques sans contact, l'efficacité et la précision du contrôle étant améliorées par la détection des défauts grâce à l'acquisition d'images photoacoustiques de pièces traitées thermiquement à haute fréquence. L'appareil comprend : une unité de mesure de signaux photoacoustiques sans contact comprenant une unité d'émission de lumière, qui comprend un laser à impulsions nanosecondes destiné à générer des signaux photoacoustiques, et une unité de mesure optique, qui comporte un laser à onde continue (CW), un interféromètre optique et un module d'acquisition de signaux, et qui mesure les signaux photoacoustiques qui sont générés lorsque le laser à impulsions nanosecondes est émis par l'unité d'émission de lumière en direction d'une cible de mesure ; une unité de détection d'emplacement de défauts qui calcule une durée de propagation d'ondes photoacoustiques à l'aide des résultats de mesure des signaux photoacoustiques de l'unité de mesure de signaux photoacoustiques sans contact, et détecte l'emplacement de défauts par calcul de la taille d'ondes photoacoustiques générées à des emplacements arbitraires ; et une unité d'imagerie d'emplacement des défauts qui présente les résultats de détection de l'unité de détection d'emplacement de défauts sous la forme d'une image tridimensionnelle, et qui présente les informations d'emplacement et de taille des défauts sous la forme d'une image.
(KO) 본 발명은 고주파 열처리 부품의 광음향(Photoacoustic) 영상을 획득하여 결함 검출을 하는 것에 의해 검사 효율성 및 정확도를 높인 비접촉 광음향 영상을 이용한 고주파 열처리 금속 내부의 비파괴 결함 검사 장치 및 방법에 관한 것으로, 광음향 신호를 발생시키기 위한 나노초 펄스레이저를 갖는 광조사부와, CW(Continues wave) 레이저, 광간섭계, 신호 획득 모듈을 구비하고 광조사부에서 나노초 펄스레이저를 측정대상체에 조사하여 발생하는 광음향 신호를 측정하는 광측정부를 포함하는 비접촉 광음향 신호 측정부;상기 비접촉 광음향 신호 측정부의 광음향신호 측정 결과를 이용하여 광음향파 전달 시간을 계산하여, 임의의 위치에서 발생된 광음향 파의 크기를 계산하여 결함 위치를 검출하는 결함 위치 검출부;상기 결함 위치 검출부의 검출 결과를 3차원 영상으로 구현하여 결함의 위치와 크기 정보를 이미지화하는 결함 위치 영상화부;를 포함하는 것이다.
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