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1. WO2022092308 - HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

Publication Number WO/2022/092308
Publication Date 05.05.2022
International Application No. PCT/JP2021/040194
International Filing Date 01.11.2021
IPC
H04B 1/38 2015.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H03H 7/46 2006.1
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7Multiple-port networks comprising only passive electrical elements as network components
46Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H03H 9/25 2006.1
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25Constructional features of resonators using surface acoustic waves
H03H 9/72 2006.1
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
72Networks using surface acoustic waves
H04B 1/00 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 田中 塁 TANAKA, Rui
Agents
  • 特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE
Priority Data
2020-18388502.11.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
(FR) MODULE HAUTE FRÉQUENCE ET DISPOSITIF DE COMMUNICATION
(JA) 高周波モジュール及び通信装置
Abstract
(EN) The purpose of the present invention is to suppress deterioration of characteristics of a second filter due to the influence of heat generated in a first filter during simultaneous transmission using both the first filter and the second filter. A high frequency module comprises a mounting substrate (30), a first filter (7A), a second filter (7D), a shield layer (33), and a conductor (401). The mounting substrate (30) has a first main surface (35) and a second main surface facing each other. The shield layer (33) is provided on the outer surface of a resin layer that covers the first filter (7A) and the second filter (7D). Simultaneous transmission using both the first filter (7A) and the second filter (7D) is possible. The conductor (401) is provided on a first main surface (35) of the mounting substrate (30) and is in contact with the transmission filter (7A) and the mounting substrate (30). The conductor (401) is in contact with the shield layer (33) on a side of the first filter (7A) that is different from that facing the second filter (7D).
(FR) L'objectif de la présente invention est de supprimer la détérioration des caractéristiques d'un second filtre en raison de l'influence de la chaleur générée dans un premier filtre pendant une transmission simultanée à l'aide du premier filtre et du second filtre. Un module haute fréquence comprend un substrat de montage (30), un premier filtre (7A), un second filtre (7D), une couche de protection (33) et un conducteur (401). Le substrat de montage (30) comprend une première surface principale (35) et une seconde surface principale (312) se faisant face. La couche de protection (33) est disposée sur la surface externe d'une couche de résine qui recouvre le premier filtre (7A) et le second filtre (7D). La transmission simultanée utilisant à la fois le premier filtre (7A) et le second filtre (7D) est possible. Le conducteur (401) est disposé sur une première surface principale (35) du substrat de montage (30) et en contact avec le filtre de transmission (7A) et le substrat de montage (30). Le conducteur (401) est en contact avec la couche de protection (33) sur un côté du premier filtre (7A) qui est différent de celui faisant face au second filtre (7D).
(JA) 第1フィルタと第2フィルタとの両方を利用した同時送信の際に第1フィルタで発生する熱の影響による第2フィルタの特性の劣化を抑制する。高周波モジュールは、実装基板(30)と第1フィルタ(7A)と第2フィルタ(7D)とシールド層(33)と導体(401)とを備える。実装基板(30)は、互いに対向する第1主面(35)及び第2主面を有する。シールド層(33)は、第1フィルタ(7A)及び第2フィルタ(7D)を覆う樹脂層の外表面に設けられている。第1フィルタ(7A)と第2フィルタ(7D)との両方を利用した同時送信が可能である。導体(401)は、実装基板(30)の第1主面(35)に設けられ、送信フィルタ(7A)と実装基板(30)とに接触する。導体(401)は、第1フィルタ(7A)における第2フィルタ(7D)の側と異なる側においてシールド層(33)と接触する。
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