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1. WO2022092047 - ELECTRICALLY CONDUCTIVE ADHESIVE, ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

Publication Number WO/2022/092047
Publication Date 05.05.2022
International Application No. PCT/JP2021/039374
International Filing Date 25.10.2021
IPC
C09J 9/02 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 11/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 11/06 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 201/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/38 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
H01R 11/01 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01characterised by the form or arrangement of the conductive interconnection between their connecting locations
CPC
C09J 11/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
04inorganic
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
H01R 11/01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01characterised by the form or arrangement of the conductive interconnection between the connecting locations
Applicants
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP]/[JP]
Inventors
  • 熊倉 博之 KUMAKURA, Hiroyuki
  • 佐藤 大祐 SATO, Daisuke
  • 柄木田 充宏 KARAKIDA, Mitsuhiro
  • 宮内 幸一 MIYAUCHI, Koichi
  • 青木 和久 AOKI, Kazuhisa
  • 林 直樹 HAYASHI, Naoki
  • 奥宮 秀昭 OKUMIYA, Hideaki
Agents
  • 野口 信博 NOGUCHI, Nobuhiro
Priority Data
2020-18158929.10.2020JP
2020-20028202.12.2020JP
2021-17409225.10.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRICALLY CONDUCTIVE ADHESIVE, ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
(FR) ADHÉSIF ÉLECTROCONDUCTEUR, FILM ÉLECTROCONDUCTEUR ANISOTROPE, STRUCTURE DE CONNEXION ET PROCÉDÉ DE FABRICATION D'UNE STRUCTURE DE CONNEXION
(JA) 導電性接着剤、異方性導電フィルム、接続構造体、及び接続構造体の製造方法
Abstract
(EN) Provided is an electrically conductive adhesive able to achieve good solder wettability and electrical conductivity. Also provided are: an anisotropic electrically conductive film which can achieve good solder wettability, electrical conductivity and insulation properties; a connection structure; and a method for producing a connection structure. This anisotropic electrically conductive film contains a thermosetting binder, solder particles and a dicarboxylic acid. The solder particles contain 50-80 wt% of Sn and 20-50 wt% of Bi. The blending quantity of the dicarboxylic acid is 1-15 parts by mass relative to 100 parts by mass of the thermosetting binder. The blending quantity of solder particles having an average particle diameter of particles 40-5 µm among the solder is 100-1200 parts by mass relative to 100 parts by mass of the thermosetting binder. The thickness of the anisotropic electrically conductive film is more than 110% and not more than 700% of the average particle diameter of the solder particles. Due to this configuration, it is possible to achieve good solder wettability, electrical conductivity and insulation properties.
(FR) L'invention concerne un adhésif électroconducteur permettant une mouillabilité de brasure et une conductivité électrique satisfaisantes. L'invention concerne également : un film électroconducteur anisotrope qui assure une mouillabilité de brasure, une conductivité électrique et des propriétés d'isolation satisfaisantes ; une structure de connexion ; et un procédé de fabrication d'une structure de connexion. Ce film électroconducteur anisotrope contient un liant thermodurcissable, des particules de brasure et un acide dicarboxylique. Les particules de brasure contiennent 50 à 80 % en poids de Sn et 20 à 50 % en poids de Bi. La quantité, dans le mélange, d'acide dicarboxylique varie de 1 à 15 parties en masse pour 100 parties en masse du liant thermodurcissable. La quantité, dans le mélange, de particules de brasure présentant un diamètre de particule moyen de 40 à 5 µm au sein de la brasure varie de 100 à 1 200 parties en masse pour 100 parties en masse du liant thermodurcissable. L'épaisseur du film électroconducteur anisotrope est supérieure à 110 % et inférieure ou égale à 700 % du diamètre de particule moyen des particules de brasure. Grâce à cette configuration, il est possible d'obtenir une mouillabilité de brasure, une conductivité électrique et des propriétés d'isolation satisfaisantes.
(JA) 良好なはんだ濡れ性、及び導通性を得ることができる導電性接着剤を提供する。また、良好なはんだ濡れ性、導通性、及び絶縁性を得ることができる異方性導電フィルム、接続構造体、及び接続構造体の製造方法を提供する。異方性導電フィルムは、熱硬化性バインダーと、はんだ粒子と、ジカルボン酸とを含有し、はんだ粒子が、50~80wt%のSnと、20~50wt%のBiとを含み、ジカルボン酸の配合量が、熱硬化性バインダー100質量部に対して1~15質量部であり、はんだ粒子の平均粒径40~5μmに対するはんだ粒子の配合量が、熱硬化性バインダー100質量部に対して100~1200質量部であり、異方性導電フィルムの厚みが、はんだ粒子の平均粒径の110%超700%以下である。これにより、良好なはんだ濡れ性、導通性、及び絶縁性を得ることができる。
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