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1. WO2022088955 - DISPLAY SUBSTRATE, DISPLAY DEVICE, AND DETECTION METHOD FOR DISPLAY SUBSTRATE

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Publication Number WO/2022/088955
Publication Date 05.05.2022
International Application No. PCT/CN2021/116001
International Filing Date 01.09.2021
IPC
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 23/544 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
544Marks applied to semiconductor devices, e.g. registration marks, test patterns
H01L 21/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
H01L 22/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
10Measuring as part of the manufacturing process
12for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
H01L 22/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
32Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/0031
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0031Testing, e.g. accelerated lifetime tests of photoelectric devices
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 王涛 WANG, Tao
  • 孙韬 SUN, Tao
  • 秦成杰 QIN, Chengjie
  • 张子予 ZHANG, Ziyu
  • 洪瑞 HONG, Rui
  • 王有为 WANG, Youwei
Agents
  • 中科专利商标代理有限责任公司 CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.
Priority Data
202011175489.828.10.2020CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY SUBSTRATE, DISPLAY DEVICE, AND DETECTION METHOD FOR DISPLAY SUBSTRATE
(FR) SUBSTRAT D'AFFICHAGE, DISPOSITIF D'AFFICHAGE ET PROCÉDÉ DE DÉTECTION DE SUBSTRAT D'AFFICHAGE
(ZH) 显示基板、显示装置和用于显示基板的检测方法
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Abstract
(EN) Embodiments of the present invention provide a display substrate, a display device, and a detection method for the display substrate. The display substrate comprises: a substrate, comprising a display area and a peripheral area located on at least one side of the display area; a crack blocking member located in the peripheral area, the crack blocking member being configured to block a crack from extending toward the display area; a packaging structure provided on the substrate and covering the display area; and a crack detection structure provided on the substrate, wherein the crack detection structure is located on the side of the crack blocking member close to the display area, the orthographic projection of the crack detection structure on the substrate falls into the orthographic projection of the packaging structure on the substrate, and the crack detection structure is configured to detect whether a crack occurs in the packaging structure.
(FR) Certains modes de réalisation de la présente invention concernent un substrat d'affichage, un dispositif d'affichage et un procédé de détection pour le substrat d'affichage. Le substrat d'affichage comprend : un substrat, comprenant une zone d'affichage et une zone périphérique située sur au moins un côté de la zone d'affichage ; un élément de blocage de fissures situé dans la zone périphérique, l'élément de blocage de fissures étant configuré pour bloquer une fissure de s'étendre vers la zone d'affichage ; une structure d'encapsulation disposée sur le substrat et recouvrant la zone d'affichage ; et une structure de détection de fissures disposée sur le substrat, la structure de détection de fissures étant située sur le côté de l'élément de blocage de fissures à proximité de la zone d'affichage, la projection orthographique de la structure de détection de fissures sur le substrat tombe dans la projection orthographique de la structure d'encapsulation sur le substrat, et la structure de détection de fissures est configurée pour détecter si une fissure se produit dans la structure d'encapsulation.
(ZH) 本公开的实施例提供一种显示基板，一种显示装置，以及一种用于显示基板的检测方法。所述显示基板包括：衬底基板，所述衬底基板包括显示区和位于所述显示区至少一侧的外围区；位于所述外围区中的裂纹阻挡件，所述裂纹阻挡件被配置为阻挡裂纹朝所述显示区延伸；设置于所述衬底基板上且覆盖所述显示区的封装结构；以及设置于所述衬底基板上的裂纹检测结构，其中，所述裂纹检测结构位于所述裂纹阻挡件靠近所述显示区的一侧，所述裂纹检测结构在所述衬底基板上的正投影落入所述封装结构在所述衬底基板上的正投影内，所述裂纹检测结构被配置为检测所述封装结构中是否出现裂纹。
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