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1. WO2022076399 - SYSTEM AND METHOD FOR HIGH VOLTAGE ISOLATION WITH THERMAL CONDUCTIVITY

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Publication Number WO/2022/076399
Publication Date 14.04.2022
International Application No. PCT/US2021/053554
International Filing Date 05.10.2021
IPC
H01S 5/02212 2021.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02208characterised by the shape of the housings
02212Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
CPC
H04J 14/0202
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
JMULTIPLEX COMMUNICATION
14Optical multiplex systems
02Wavelength-division multiplex systems
0201Add-and-drop multiplexing
0202Arrangements therefor
H05K 7/1432
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
1427Housings
1432for power drive units
H05K 7/2039
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
H05K 7/209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2089for power electronics, e.g. for inverters for controlling motor
209Heat transfer by conduction from internal heat source to heat radiating structure
Applicants
  • RAYTHEON COMPANY [US]/[US]
Inventors
  • DUBE, Richard, P.
  • LANGELIER, Mark, S.
  • SEFCSIK JR., Paul, A.
  • ROSA, Jason, P.
  • CARLSTEN, Curtis, B.
  • JANIK, Michael, F.
  • FRANKLIN, JR., Mark, R.
Agents
  • DOYLE, David, M.
  • MUNCK, William, A.
Priority Data
17/066,39108.10.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) SYSTEM AND METHOD FOR HIGH VOLTAGE ISOLATION WITH THERMAL CONDUCTIVITY
(FR) SYSTÈME ET PROCÉDÉ D'ISOLATION HAUTE TENSION À CONDUCTIVITÉ THERMIQUE
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Abstract
(EN) A system includes a first slice (101) and a second slice (102, 103) coupled to each other. Each slice includes a housing (110) formed of an electrically-insulative material, a ceramic plate (130) disposed at each end of the housing, and an end plate (135) disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly (120) coupled to the first slice and the second slice.
(FR) Un système comprend une première tranche (101) et une seconde tranche (102, 103) reliées l'une à l'autre. Chaque tranche comprend une enveloppe (110) formée d'un matériau électriquement isolant, une plaque de céramique (130) disposée à chaque extrémité de l'enveloppe, et une plaque d'extrémité (135) disposée sur chacune des plaques de céramique. Chaque plaque d'extrémité est formée d'un matériau thermoconducteur. Le système comprend également un ensemble fond de panier (120) relié à la première tranche et à la seconde tranche.
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Latest bibliographic data on file with the International Bureau
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