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1. WO2022075172 - POROUS BODY, HEAT-DISSIPATING STRUCTURE, AND ELECTRONIC APPARATUS

Publication Number WO/2022/075172
Publication Date 14.04.2022
International Application No. PCT/JP2021/036111
International Filing Date 30.09.2021
IPC
H01L 23/373 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H01L 23/427 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
C22C 1/08 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making non-ferrous alloys
08Alloys with open or closed pores
F28D 15/02 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
F28D 15/04 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
04with tubes having a capillary structure
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
B22F 3/11
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
3Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; ; Presses and furnaces
10Sintering only
11Making porous workpieces or articles
C22C 1/08
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
1Making alloys
08Alloys with open or closed pores
F28D 15/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
F28D 15/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 小島 慶次郎 KOJIMA, Keijiro
  • 沼本 竜宏 NUMOTO, Tatsuhiro
  • 若岡 拓生 WAKAOKA, Takuo
  • 澤田 恵理子 SAWADA, Eriko
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2020-16933606.10.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) POROUS BODY, HEAT-DISSIPATING STRUCTURE, AND ELECTRONIC APPARATUS
(FR) CORPS POREUX, STRUCTURE DE DISSIPATION DE CHALEUR ET APPAREIL ÉLECTRONIQUE
(JA) 多孔質体、放熱構造体及び電子機器
Abstract
(EN) Provided is a porous body that allows a fluid, e.g., a liquid, to move from one surface to another surface and can hold and store a large amount of the fluid. This porous body (10) has a first principal surface (11), a second principal surface (12) that is opposite the first principal surface (11), and a plurality of pores (20). At least a portion of the pores (20) are connecting pores (21) that connect the first principal surface (11) and the second principal surface (12). When a first cross-section (CS1) is taken by bisecting the porous body (10) perpendicularly to the direction from the first principal surface (11) to the second principal surface (12), the porosity of the first principal surface (11) is less than the porosity of the first cross-section (CS1), and the porosity of the second principal surface (12) is also less than the porosity of the first cross-section (CS1).
(FR) L'invention concerne un corps poreux qui permet à un fluide, par exemple, un liquide, de se déplacer d'une surface à une autre surface et peut contenir et stocker une grande quantité de fluide. Ce corps poreux (10) présente une première surface principale (11), une seconde surface principale (12) qui est opposée à la première surface principale (11) et une pluralité de pores (20). Au moins une partie des pores (20) sont des pores de liaison (21) qui relient la première surface principale (11) et la seconde surface principale (12). Lorsqu'une première section transversale (CS1) est prise en coupant le corps poreux (10) perpendiculairement à la direction allant de la première surface principale (11) à la seconde surface principale (12), la porosité de la première surface principale (11) est inférieure à la porosité de la première section transversale CS1), et la porosité de la seconde surface principale (12) est également inférieure à la porosité de la première section transversale (CS1).
(JA) 液体等の流体が一方の面から他方の面に移動可能であり、多くの流体を保持及び貯蔵することができる多孔質体を提供する。 本発明の多孔質体(10)は、第1主面(11)と、上記第1主面(11)と対向する第2主面(12)とを有し、複数の細孔(20)を有する多孔質体であって、少なくとも一部の上記細孔(20)は、上記第1主面(11)と上記第2主面(12)とを連通する連通孔(21)であり、上記第1主面(11)から上記第2主面(12)の方向に対し垂直に、上記多孔質体(10)を2等分するように切断した断面を多孔質体の第1断面(CS)とした際に、上記第1主面(11)の空隙率は、上記第1断面(CS)の空隙率よりも小さく、かつ、上記第2主面(12)の空隙率は、上記第1断面(CS)の空隙率よりも小さい。
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