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1. WO2022072518 - RACK FORM-FACTOR RESERVOIR FOR DATACENTER COOLING SYSTEMS

Publication Number WO/2022/072518
Publication Date 07.04.2022
International Application No. PCT/US2021/052680
International Filing Date 29.09.2021
IPC
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
203by immersion
H05K 7/20327
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
H05K 7/20381
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20381Thermal management, e.g. evaporation control
H05K 7/20509
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20509Cold plates, e.g. multi-component heat spreader, support plates, non closed structures
H05K 7/20772
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
20772within server blades for removing heat from heat source
H05K 7/2079
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
2079within rooms for removing heat from cabinets
Applicants
  • NVIDIA CORPORATION [US]/[US]
Inventors
  • HEYDARI, Ali
Agents
  • LOHR, Jason
  • REDDY, Sanjiva
Priority Data
17/061,32001.10.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) RACK FORM-FACTOR RESERVOIR FOR DATACENTER COOLING SYSTEMS
(FR) RÉSERVOIR À FACTEUR DE FORME DE BAIE POUR SYSTÈMES DE REFROIDISSEMENT DE CENTRE DE DONNÉES
Abstract
(EN) Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a fluid reservoir in a form-factor of at least one rack is provided, the fluid reservoir to store fluid, the fluid to be passed to a cold plate or an immersive-cooled server, and the fluid to be cooled by a secondary cooling loop or an air-cooling system.
(FR) La présente invention concerne des systèmes et des procédés de refroidissement d'un centre de données. Dans au moins un mode de réalisation, un réservoir de fluide dans un facteur de forme d'au moins une baie est fourni, le réservoir de fluide est destiné à stocker un fluide, le fluide est destiné à être transféré à une plaque froide ou à un serveur refroidi par immersion, et le fluide est destiné à être refroidi par une boucle de refroidissement secondaire ou un système de refroidissement à air.
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