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1. WO2022071329 - RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED OBJECT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR

Publication Number WO/2022/071329
Publication Date 07.04.2022
International Application No. PCT/JP2021/035672
International Filing Date 28.09.2021
IPC
C08G 73/10 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
H01L 23/29 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 21/312 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
312Organic layers, e.g. photoresist
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
CPC
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
H01L 21/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques
H01L 21/60
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
  • HDマイクロシステムズ株式会社 HD MICROSYSTEMS, LTD. [JP]/[JP]
Inventors
  • 米田 聡 YONEDA, Satoshi
  • 生田目 豊 NAMATAME, Yutaka
  • 柴田 智章 SHIBATA, Tomoaki
  • 小林 香織 KOBAYASHI, Kaori
  • 小野関 仁 ONOZEKI, Hitoshi
  • 鈴木 直也 SUZUKI, Naoya
  • 野中 敏央 NONAKA, Toshihisa
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
PCT/JP2020/03732230.09.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED OBJECT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR
(FR) COMPOSITION DE RÉSINE, PROCÉDÉ DE PRODUCTION DE DISPOSITIF À SEMI-CONDUCTEUR, OBJET DURCI, DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE SYNTHÈSE D'UN PRÉCURSEUR DE POLYIMIDE
(JA) 樹脂組成物、半導体装置の製造方法、硬化物、半導体装置及びポリイミド前駆体の合成方法
Abstract
(EN) A resin composition which comprises (A) a polyimide resin and/or a polyimide precursor that is at least one resin selected from the group consisting of poly(amic acid)s, poly(amic acid) esters, poly(amic acid) salts, and poly(amic acid amide)s and (B) a solvent and which is for use in forming a first organic insulating film and/or a second organic insulating film in a method for producing a semiconductor device, the method comprising steps (1) to (5).
(FR) L'invention concerne une composition de résine qui comprend (A) une résine de polyimide et/ou un précurseur de polyimide qui est au moins une résine choisie dans le groupe constitué par des acides polyamiques, des esters d'acide polyamique, des sels d'acide polyamique, et des amides d'acide polyamique, et (B) un solvant, et qui est destinée à être utilisée dans la formation d'un premier film isolant organique et/ou d'un second film isolant organique dans un procédé de production d'un dispositif à semi-conducteur, le procédé comprenant les étapes (1) à (5).
(JA) (A)ポリアミド酸、ポリアミド酸エステル、ポリアミド酸塩及びポリアミド酸アミドからなる群より選択される少なくとも1種の樹脂であるポリイミド前駆体、並びにポリイミド樹脂の少なくとも一方と、(B)溶剤と、を含み、工程(1)~工程(5)を含む半導体装置の製造方法での第1有機絶縁膜及び第2有機絶縁膜の少なくとも一方の絶縁膜の作製に用いるための樹脂組成物。
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