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1. WO2022045580 - MICRO LED PACKAGE AND DISPLAY MODULE COMPRISING SAME

Publication Number WO/2022/045580
Publication Date 03.03.2022
International Application No. PCT/KR2021/009029
International Filing Date 14.07.2021
IPC
H01L 25/13 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
13the devices being of a type provided for in group H01L33/78
H01L 25/075 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/78
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/528 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
528Layout of the interconnection structure
H01L 33/48 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
CPC
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H01L 23/528
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
528Geometry or; layout of the interconnection structure
H01L 25/075
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/13
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
13the devices being of a type provided for in group H01L33/00
H01L 33/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
Applicants
  • 삼성전자주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 이형진 LEE, Hyungjin
  • 강진희 KANG, Jinhee
Agents
  • 김태헌 KIM, Tae-hun
  • 정홍식 JEONG, Hong-sik
Priority Data
10-2020-010963728.08.2020KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) MICRO LED PACKAGE AND DISPLAY MODULE COMPRISING SAME
(FR) BOÎTIER DE MICRO-DEL ET MODULE D'AFFICHAGE LE COMPRENANT
(KO) 마이크로 LED 패키지 및 이를 구비한 디스플레이 모듈
Abstract
(EN) A light-emitting diode package and a display module comprising same are disclosed. The light-emitting diode package comprises: a transparent layer; a plurality of light-emitting diodes disposed on one side of the transparent layer at uniform intervals with a light-emitting surface facing the transparent layer; a spacer formed on one side of the transparent layer and having a larger height than the height up to an electrode pad of the plurality of light-emitting diodes on the basis of one side of the transparent layer; and a protective member covering the plurality of light-emitting diodes.
(FR) L'invention concerne un boîtier de diode électroluminescente et un module d'affichage le comprenant. Le boîtier de diode électroluminescente comprend : une couche transparente ; une pluralité de diodes électroluminescentes disposées sur un côté de la couche transparente à des intervalles uniformes avec une surface électroluminescente faisant face à la couche transparente ; une entretoise formée sur un côté de la couche transparente et ayant une hauteur supérieure à la hauteur jusqu'à un plot d'électrode de la pluralité de diodes électroluminescentes sur la base d'un côté de la couche transparente ; et un élément de protection recouvrant la pluralité de diodes électroluminescentes.
(KO) 발광 다이오드 패키지 및 이를 구비한 디스플레이 모듈이 개시된다. 상기 발광 다이오드 패키지는 투명 층과, 발광면이 상기 투명 층을 향하도록 일정한 간격을 두고 상기 투명 층의 일 면에 배치되는 다수의 발광 다이오드와, 상기 투명 층의 일 면에 형성되며 상기 투명 층의 일 면을 기준으로 상기 다수의 발광 다이오드의 전극 패드까지의 높이보다 더 큰 높이를 가지는 스페이서와, 상기 다수의 발광 다이오드를 덮는 보호 부재를 구비한다.
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