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1. WO2022045140 - CERAMIC PLATE AND METHOD FOR MANUFACTURING SAME, BONDING SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2022/045140
Publication Date 03.03.2022
International Application No. PCT/JP2021/031003
International Filing Date 24.08.2021
IPC
B28B 11/12 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
11Apparatus or processes for treating or working the shaped articles
12for removing parts of the articles by cutting
B23K 26/38 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
C04B 37/02 2006.1
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
C04B 41/91 2006.1
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
41After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
80of only ceramics
91involving the removal of part of the materials of the treated articles, e.g. etching
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
B23K 26/38
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
B28B 11/12
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
11Apparatus or processes for treating or working the shaped ; or preshaped; articles
12for removing parts of the articles by cutting
C04B 37/02
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
C04B 41/91
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
41After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
80of only ceramics
91involving the removal of part of the materials of the treated articles, e.g. etching
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
Applicants
  • デンカ株式会社 DENKA COMPANY LIMITED [JP]/[JP]
Inventors
  • 湯浅 晃正 YUASA Akimasa
  • 中村 貴裕 NAKAMURA Takahiro
  • 江嶋 善幸 ESHIMA Yoshiyuki
  • 五十嵐 厚樹 IKARASHI Koki
  • 西村 浩二 NISHIMURA Koji
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 中塚 岳 NAKATSUKA Takeshi
Priority Data
2020-14169925.08.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CERAMIC PLATE AND METHOD FOR MANUFACTURING SAME, BONDING SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
(FR) PLAQUE EN CÉRAMIQUE ET SON PROCÉDÉ DE FABRICATION, SUBSTRAT DE LIAISON ET SON PROCÉDÉ DE FABRICATION, ET CARTE DE CIRCUIT IMPRIMÉ ET SON PROCÉDÉ DE FABRICATION
(JA) セラミック板及びその製造方法、接合基板及びその製造方法、並びに、回路基板及びその製造方法
Abstract
(EN) Provided is a ceramic plate 101 having a corner section 12, wherein the corner section 12 and side surfaces 10 adjacent to each other with the corner section 12 therebetween are constituted by cut surfaces cut by a laser beam. Also provided is a method for manufacturing the ceramic plate 101, the method including a step for irradiating a main surface of a plate-shaped ceramic base material with a laser beam to cut an end section 62 of the ceramic base material, and forming the corner section 12 and the side surfaces 10 adjacent to each other with the corner section 12 therebetween.
(FR) La présente invention concerne une plaque en céramique (101) ayant une section de coin (12), la section de coin (12) et les surfaces latérales (10) adjacentes l’une à l’autre avec la section de coin (12) entre elles étant constituées de surfaces de coupe coupées par un faisceau laser. L’invention concerne également un procédé de fabrication de la plaque en céramique (101), le procédé comprenant une étape d’irradiation d’une surface principale d’un matériau de base en céramique en forme de plaque au moyen d'un faisceau laser pour couper une section d’extrémité (62) du matériau de base en céramique, et former la section de coin (12) et les surfaces latérales (10) adjacentes l’une à l’autre avec la section de coin (12) entre elles.
(JA) 角部12を有するセラミック板101であって、角部12と、角部12を介して隣り合う側面10が、レーザー光によって切断された切断面で構成されるセラミック板101を提供する。板状のセラミック基材の主面にレーザー光を照射してセラミック基材の端部62を切断し、角部12と角部12を介して隣り合う側面10を形成する工程を有する、セラミック板101の製造方法を提供する。
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