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1. WO2022044504 - CIRCUIT MODULE AND SUBMODULE MANUFACTURING METHOD

Publication Number WO/2022/044504
Publication Date 03.03.2022
International Application No. PCT/JP2021/023191
International Filing Date 18.06.2021
IPC
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 25/18 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H01L 25/04 2014.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
H05K 9/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
CPC
H01L 23/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 25/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
H05K 1/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 大坪 喜人 OTSUBO, Yoshihito
  • 畑瀬 稔 HATASE, Minoru
Agents
  • 山尾 憲人 YAMAO, Norihito
  • 徳山 英浩 TOKUYAMA, Hidehiro
Priority Data
2020-14616231.08.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT MODULE AND SUBMODULE MANUFACTURING METHOD
(FR) MODULE DE CIRCUIT ET PROCÉDÉ DE FABRICATION DE SOUS-MODULE
(JA) 回路モジュール及びサブモジュールの製造方法
Abstract
(EN) Provided is a circuit module with which an increase in the size of a circuit module is suppressed and shielding performance for a submodule can be enhanced. This circuit module 1 comprises: a main substrate 20; a submodule 40 mounted on a surface 20A of the main substrate 20; a main sealing resin 50 that is provided on the surface 20A of the main substrate 20 and covers at least a portion of the submodule 40; and a conductive shielding film 60 that covers at least a portion of the main sealing resin 50. The submodule 40 comprises: a sub-substrate 41; an electronic component 42 mounted on a surface 41A of the sub-substrate 41; a plurality of conductive members 43 that have a linear shape and that are connected between the surface 41A of the sub-substrate 41 and the shielding film 60; and a sub-sealing resin 44 that is provided on the surface 41A of the sub-substrate 41 and that covers the electronic component 42 and the conductive members 43.
(FR) L'invention concerne un module de circuit avec lequel une augmentation de la taille d'un module de circuit est empechée et la performance de blindage pour un sous-module peut être améliorée. Ce module de circuit 1 comprend : un substrat principal 20 ; un sous-module 40 monté sur une surface 20A du substrat principal 20 ; une résine d'étanchéité principale 50 qui est disposée sur la surface 20A du substrat principal 20 et recouvre au moins une partie du sous-module 40 ; et un film de blindage conducteur 60 qui recouvre au moins une partie de la résine d'étanchéité principale 50. Le sous-module 40 comprend : un sous-substrat 41 ; un composant électronique 42 monté sur une surface 41A du sous-substrat 41 ; une pluralité d'éléments conducteurs 43 qui ont une forme linéaire et qui sont connectés entre la surface 41A du sous-substrat 41 et le film de blindage 60 ; et une résine de sous-étanchéité 44 qui est disposée sur la surface 41A du sous-substrat 41 et qui recouvre le composant électronique 42 et les éléments conducteurs 43.
(JA) 回路モジュールの大型化を抑制しつつも、サブモジュールに対するシールド性能を強化することができる回路モジュールを提供する。本発明に係る回路モジュール1は、メイン基板20と、メイン基板20の表面20Aに実装されたサブモジュール40と、メイン基板20の表面20Aに設けられており、サブモジュール40の少なくとも一部を覆うメイン封止樹脂50と、メイン封止樹脂50の少なくとも一部を覆う導電性のシールド膜60とを備える。サブモジュール40は、サブ基板41と、サブ基板41の表面41Aに実装された電子部品42と、線状であってサブ基板41の表面41Aとシールド膜60とに接続された複数の導電部材43と、サブ基板41の表面41Aに設けられており、電子部品42及び各導電部材43を覆うサブ封止樹脂44とを備える。
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