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1. WO2022044490 - SEMICONDUCTOR MANUFACTURING DEVICE, MEASURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD

Publication Number WO/2022/044490
Publication Date 03.03.2022
International Application No. PCT/JP2021/022609
International Filing Date 15.06.2021
IPC
H01L 21/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applicants
  • 株式会社写真化学 SHASHIN KAGAKU CO., LTD. [JP]/[JP]
Inventors
  • 堀江正浩 HORIE Masahiro
Agents
  • 特許業務法人R&C R&C IP LAW FIRM
Priority Data
2020-14155225.08.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR MANUFACTURING DEVICE, MEASURING DEVICE, AND SEMICONDUCTOR MANUFACTURING METHOD
(FR) DISPOSITIF DE FABRICATION DE SEMI-CONDUCTEUR, DISPOSITIF DE MESURE ET PROCÉDÉ DE FABRICATION DE SEMI-CONDUCTEUR
(JA) 半導体製造装置、測定装置及び半導体製造方法
Abstract
(EN) The present disclosure relates to techniques for performing a predetermined process on a wafer and inspecting the state of the wafer on which the predetermined process has been performed, and provides a semiconductor manufacturing device that is more convenient than before and can be implemented by means of a relatively simple configuration. The semiconductor manufacturing device comprises: a processing device for performing a predetermined process on a wafer in a processing chamber; a housing forming a transfer chamber; a transfer mechanism disposed in the transfer chamber to transfer a wafer; a plurality of load ports attached to the housing forming the transfer chamber; a transfer container detachably and hermetically attached to at least one of the plurality of load ports; and a measuring unit 35 disposed in a measuring chamber 26a. A measuring device 25 for measuring the state of the wafer on which the predetermined process has been performed is detachably and hermetically attached to a load port 10d different from the load port to which the transfer container is attached. The transfer mechanism loads the wafer unloaded from the transfer container into the processing chamber, unloads the wafer on which the predetermined process has been performed from the processing chamber, and loads the wafer into the measuring chamber 26a.
(FR) La présente invention concerne des techniques permettant d'effectuer un processus prédéterminé sur une tranche et d'inspecter l'état de la tranche sur laquelle le processus prédéterminé a été effectué, et fournit un dispositif de fabrication de semi-conducteur qui est plus pratique qu'avant et peut être mis en œuvre au moyen d'une configuration relativement simple. Le dispositif de fabrication de semi-conducteur comprend : un dispositif de traitement pour effectuer un processus prédéterminé sur une tranche dans une chambre de traitement ; un boîtier formant une chambre de transfert ; un mécanisme de transfert disposé dans la chambre de transfert pour transférer une tranche ; une pluralité d'orifices de charge fixés au boîtier formant la chambre de transfert ; un récipient de transfert fixé de manière amovible et hermétique à au moins l'un de la pluralité d'orifices de charge ; et une unité de mesure 35 disposée dans une chambre de mesure 26a. Un dispositif de mesure 25 pour mesurer l'état de la tranche sur laquelle le processus prédéterminé a été effectué est fixé de façon détachable et hermétique à un orifice de charge 10d différent de l'orifice de charge auquel le récipient de transfert est fixé. Le mécanisme de transfert charge la tranche déchargée du récipient de transfert dans la chambre de traitement, décharge la tranche sur laquelle le processus prédéterminé a été réalisé à partir de la chambre de traitement, et charge la tranche dans la chambre de mesure 26a.
(JA) ウェハに所定の処理を施すとともに所定の処理が施されたウェハの状態を検査できる技術であって、従来よりも利便性に優れ、比較的単純な構成で実現可能な半導体製造装置を提供する。処理室内でウェハに所定の処理を施す処理装置と、搬送室を形成する筐体と、搬送室内に配置され、ウェハを搬送する搬送機構と、搬送室を形成する筐体に取り付けられた複数のロードポートと、複数のロードポートのうちの少なくとも一つに着脱自在に気密状に取り付けられる搬送容器と、測定室26a内に配置された測定器35を備え、搬送容器が取り付けられるロードポートとは異なるロードポート10dに着脱自在に気密状に取り付けられ、所定の処理が施されたウェハの状態を測定する測定装置25とを備え、搬送機構は、搬送容器から搬出したウェハを処理室内に搬入し、所定の処理が施されたウェハを処理室から搬出して測定室26a内に搬入する。
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