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1. WO2022025259 - HEAT-CONDUCTING MEMBER

Publication Number WO/2022/025259
Publication Date 03.02.2022
International Application No. PCT/JP2021/028354
International Filing Date 30.07.2021
IPC
H01L 23/427 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
F28D 15/02 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
F28D 15/04 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
04with tubes having a capillary structure
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
F28D 15/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
F28D 15/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 日本電産株式会社 NIDEC CORPORATION [JP]/[JP]
  • 尼得科超▲しゅう▼科技股▲ふん▼有限公司 NIDEC CHAUN-CHOUNG TECHNOLOGY CORP.
Inventors
  • 高尾 征志 TAKAO Masashi
  • 楊 仕▲ゆ▼ YANG Shih Yu
  • 小関 敏彦 KOSEKI Toshihiko
  • 花野 雅昭 HANANO Masaaki
  • 石田 淳一 ISHIDA Junichi
Agents
  • 荒川 聡志 ARAKAWA Satoshi
  • 梶原 慶 KAJIHARA Kei
Priority Data
2020-13123031.07.2020JP
2020-18988913.11.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-CONDUCTING MEMBER
(FR) ÉLÉMENT THERMOCONDUCTEUR
(JA) 熱伝導部材
Abstract
(EN) Provided is a heat-conducting member comprising a housing comprising: a first metal plate and a second metal plate opposing each other; column parts; and an internal space. The internal space is disposed between the first metal plate and the second metal plate and accommodates a wick structure and a working medium. The internal space includes a vapor space allowing for the presence of vapor of the working medium. The vapor space is included in a space of the internal space other than the spaces occupied by the wick structure and the column part. At least one column part supports the first metal plate and the second metal plate. When viewed vertically, at least one of the sum of areas of contact between the column part contacting the first metal plate and the first metal plate and the sum of areas of contact between the column part contacting the second metal plate and the second metal plate is less than the area occupied by the vapor space when viewed vertically.
(FR) L'invention concerne un élément thermoconducteur comprenant un boîtier comprenant : une première plaque métallique et une seconde plaque métallique opposées l'une à l'autre ; des parties colonnes ; et un espace interne. L'espace interne est disposé entre la première plaque métallique et la seconde plaque métallique et loge une structure de mèche et un milieu de travail. L'espace interne comprend un espace de vapeur permettant la présence de vapeur du milieu de travail. L'espace de vapeur est inclus dans un espace de l'espace interne autre que les espaces occupés par la structure de mèche et la partie colonne. Au moins une partie colonne supporte la première plaque métallique et la seconde plaque métallique. Lorsqu'elles sont vues verticalement, au moins l'une de la somme des zones de contact entre la partie colonne en contact avec la première plaque métallique et la première plaque métallique et la somme des zones de contact entre la partie colonne en contact avec la seconde plaque métallique et la seconde plaque métallique est inférieure à la zone occupée par l'espace de vapeur lorsqu'il est vu verticalement.
(JA) 熱伝導部材の筐体は、互いに対向して配置される第1金属板及び第2金属板と、柱部と、内部空間と、を有する。内部空間は、第1金属板及び第2金属板間に配置されてウィック構造体及び作動媒体を収容する。内部空間は、作動媒体の蒸気が存在し得る蒸気空間を含む。蒸気空間は、内部空間のうち、ウィック構造体及び柱部が占める空間以外の空間に含まれる。少なくとも1つの柱部は、第1金属板及び第2金属板を支持する。鉛直方向から見て、第1金属板と接する柱部と第1金属板との接触面積の総和、及び、第2金属板と接する柱部と第2金属板との接触面積の総和のうちの少なくともどちらかは、鉛直方向から見て蒸気空間が占める面積よりも小さい。
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