Processing

Please wait...

Settings

Settings

Goto Application

1. WO2022025065 - LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE

Publication Number WO/2022/025065
Publication Date 03.02.2022
International Application No. PCT/JP2021/027764
International Filing Date 27.07.2021
IPC
H01L 33/60 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
60Reflective elements
F21V 19/00 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
F21V 23/00 2015.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
23Arrangement of electric circuit elements in or on lighting devices
H01L 33/50 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/62 2010.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
F21Y 115/10 2016.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
115Light-generating elements of semiconductor light sources
10Light-emitting diodes
CPC
F21V 19/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
F21V 23/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
23Arrangement of electric circuit elements in or on lighting devices
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 33/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/60
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
60Reflective elements
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 草野 民男 KUSANO Tamio
Agents
  • 杉村 憲司 SUGIMURA Kenji
Priority Data
2020-13114231.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT EMITTING DEVICE AND ILLUMINATION DEVICE
(FR) DISPOSITIF ÉLECTROLUMINESCENT ET DISPOSITIF D’ÉCLAIRAGE
(JA) 発光装置及び照明装置
Abstract
(EN) This light emitting device comprises: a substrate having a power supply line and a power supply pad that are electrically connected to each other; a reflective layer located on the power supply line so as to cover at least a part of the power supply line; a light emitting element that is electrically connected to the power supply line via the power supply pad and emits excitation light; and a wavelength conversion member that is located on the light emitting element and converts the excitation light into illumination light. The light emitting element is located on the power supply pad so as to cover the power supply pad in an electrical connection relationship in a plan view of the substrate.
(FR) L'invention concerne un dispositif électroluminescent comprenant : un substrat ayant une ligne d'alimentation électrique et un plot d'alimentation électrique qui sont électriquement connectés l'un à l'autre ; une couche réfléchissante située sur la ligne d'alimentation électrique de manière à recouvrir au moins une partie de la ligne d'alimentation électrique ; un élément électroluminescent qui est électriquement connecté à la ligne d'alimentation électrique par l'intermédiaire du plot d'alimentation électrique et émet une lumière d'excitation ; et un élément de conversion de longueur d'onde qui est situé sur l'élément électroluminescent et convertit la lumière d'excitation en lumière d'éclairage. L'élément électroluminescent est situé sur le plot d'alimentation électrique de manière à recouvrir le plot d'alimentation électrique dans une relation de connexion électrique dans une vue en plan du substrat.
(JA) 発光装置は、互いに電気的に接続された給電配線及び給電パッドを有する基板と、給電配線の少なくとも一部を覆うよう給電配線上に位置する反射層と、給電パッドを介して給電配線に電気的に接続され、励起光を射出する発光素子と、発光素子の上に位置し、励起光を照明光に変換する波長変換部材とを備える。発光素子は、基板の平面透視において、電気的接続関係にある給電パッドを覆うように給電パッドの上に位置する。
Latest bibliographic data on file with the International Bureau