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1. WO2022010706 - HEAT SINK ASSEMBLY FOR ELECTRONIC EQUIPMENT

Publication Number WO/2022/010706
Publication Date 13.01.2022
International Application No. PCT/US2021/039848
International Filing Date 30.06.2021
IPC
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
F28D 19/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
19Regenerative heat-exchange apparatus in which the intermediate heat-transfer medium or body is moved successively into contact with each heat-exchange medium
04using rigid bodies, e.g. mounted on a movable carrier
F28D 2021/0029
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
21Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
0028for cooling heat generating elements, e.g. for cooling electronic components or electric devices
0029Heat sinks
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
F28F 5/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
5Elements specially adapted for movement
02Rotary drums or rollers
H05K 7/20418
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
20418the radiating structures being additional and fastened onto the housing
H05K 7/20472
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
20445the coupling element being an additional piece, e.g. thermal standoff
20472Sheet interfaces
Applicants
  • CISCO TECHNOLOGY, INC. [US]/[US]
Inventors
  • GUPTA, Rohit, Dev
  • GAITONDE, Tilak
  • PAVITHRAN, Prashanth
Agents
  • FLOAM, D., Andrew
  • CROSLAND, David, W.
  • ALDAG, Andrew, J.
  • EDELL, Ira, C.
  • DEBOY, Mark
Priority Data
16/922,01507.07.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) HEAT SINK ASSEMBLY FOR ELECTRONIC EQUIPMENT
(FR) ENSEMBLE DISSIPATEUR THERMIQUE POUR ÉQUIPEMENT ÉLECTRONIQUE
Abstract
(EN) A heat sink assembly (30) for a cage (18) for a field replaceable computing module (20) includes a heat sink (31), a thermal interface material, TIM (35), and an actuation assembly (170). The heat sink (31) includes fins (140) and a mating surface (133) positioned at a base (142) of the fins (140). The TIM (35) includes a first surface (135) that is coupled to the mating surface (133) of the heat sink (31) and a second surface (136) that is opposite the first surface (135). Thus, the second surface (136) can engage a heat transfer surface (22) of a field replaceable computing module (20) installed adjacent the heat sink (31). The actuation assembly (170) includes a rotational cam (174). When the rotational cam (174) is in a first position (P2), the second surface (136) of the TIM (35) contacts the heat transfer surface (22) of the computing module (20). When the rotational cam (174) moves to a second position (PI), the second surface (136) of the TIM (35) is moved a distance (G) away from the heat transfer surface (22) of the computing module (20).
(FR) Un ensemble dissipateur thermique (30) pour une cage (18) pour un module informatique remplaçable sur le terrain (20) comprenant un dissipateur thermique (31), un matériau d'interface thermique, TIM (35), et un ensemble d'actionnement (170). Le dissipateur thermique (31) comprend des ailettes (140) et une surface d'accouplement (133) située au niveau d'une base (142) des ailettes (140). Le TIM (35) comprend une première surface (135) qui est accouplée à la surface d'accouplement (133) du dissipateur thermique (31) et une seconde surface (136) qui est opposée à la première surface (135). Ainsi, la seconde surface (136) peut venir en prise avec une surface de transfert de chaleur (22) d'un module informatique remplaçable sur le terrain (20) installé à côté du dissipateur thermique (31). L'ensemble d'actionnement (170) comprend une came rotative (174). Lorsque la came rotative (174) est dans une première position (P2), la seconde surface (136) du TIM (35) entre en contact avec la surface de transfert de chaleur (22) du module informatique (20). Lorsque la came rotative (174) se déplace vers une seconde position (PI), la seconde surface (136) du TIM (35) est déplacée à une distance (G) de la surface de transfert de chaleur (22) du module informatique (20).
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