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1. WO2022010234 - METHOD OF BONDING COPPER PILLAR SUBSTRATE BONDING USING MASK

Publication Number WO/2022/010234
Publication Date 13.01.2022
International Application No. PCT/KR2021/008599
International Filing Date 06.07.2021
IPC
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/492 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
492Bases or plates
Applicants
  • 주식회사 프로텍 PROTEC CO., LTD. [KR]/[KR]
Inventors
  • 고윤성 KO, Youn Sung
  • 안근식 AHN, Geun Sik
Agents
  • 양두열 YANG, Dooyol
Priority Data
10-2020-008324607.07.2020KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) METHOD OF BONDING COPPER PILLAR SUBSTRATE BONDING USING MASK
(FR) PROCÉDÉ DE LIAISON D'UN SUBSTRAT DE PILIER DE CUIVRE À L'AIDE D'UN MASQUE
(KO) 마스크를 이용하는 구리 필러 기판 본딩 방법
Abstract
(EN) The present invention relates to a method of bonding a copper pillar substrate using a mask, and more specifically, to a method of bonding a copper pillar substrate using a mask, wherein copper pillars in the shape of cylinders are effectively positioned on a substrate and bonded thereon with high precision. The method of bonding a copper pillar substrate using a mask of the present invention has an advantage in that the copper pillars can be effectively positioned without loss on the substrate and bonded thereon. In addition, the method of bonding a copper pillar substrate using a mask of the present invention has the advantage of effectively performing the process of mounting copper pillars of an extremely small size on substrates.
(FR) La présente invention concerne un procédé de liaison d'un substrat de pilier de cuivre à l'aide d'un masque, et plus particulièrement, un procédé de liaison d'un substrat de pilier de cuivre à l'aide d'un masque, des piliers de cuivre présentant la forme de cylindres étant efficacement positionnés sur un substrat et étant liés sur celui-ci avec une précision élevée. Le procédé de liaison d'un substrat de pilier de cuivre à l'aide d'un masque de la présente invention présente un avantage selon lequel les piliers de cuivre peuvent être efficacement positionnés sans perte sur le substrat et être liés sur celui-ci. De plus, le procédé de liaison d'un substrat de pilier de cuivre à l'aide d'un masque de la présente invention présente l'avantage d'une exécution efficace du processus de montage de piliers de cuivre d'une taille extrêmement petite sur des substrats.
(KO) 본 발명은 마스크를 이용하는 구리 필러 기판 본딩 방법에 관한 것으로, 더욱 상세하게는 원기둥 형태의 구리 필러를 효과적으로 기판에 배치하여 고정밀도로 본딩하는 마스크를 이용하는 구리 필러 기판 본딩 방법에 관한 것이다. 본 발명의 마스크를 이용하는 구리 필러 기판 본딩 방법은 구리 필러의 누락 없이 빠르고 효과적으로 구리 필러를 기판에 배치하여 본딩할 수 있는 효과가 있다. 또한, 본 발명의 마스크를 이용하는 구리 필러 기판 본딩 방법은 매우 작은 크기의 구리 필러를 기판에 탑재하는 공정을 효과적으로 수행할 수 있는 효과가 있다.
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