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1. WO2022009887 - RESIN COMPOSITION, FILM, AND CURED PRODUCT

Publication Number WO/2022/009887
Publication Date 13.01.2022
International Application No. PCT/JP2021/025479
International Filing Date 06.07.2021
IPC
C08K 5/54 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C08K 7/18 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
16Solid spheres
18inorganic
C08L 101/02 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
02characterised by the presence of specified groups
C08J 5/18 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/22 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/36 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 吉田 和宏 YOSHIDA, Kazuhiro
  • 松本 拓郎 MATSUMOTO, Takuro
  • 中村 幸治 NAKAMURA, Koji
  • 石田 恭久 ISHIDA, Yasuhisa
  • 山本 貴耶 YAMAMOTO, Takaya
  • 水之江 沙織 MIZUNOE, Saori
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
2020-11801708.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION, FILM, AND CURED PRODUCT
(FR) COMPOSITION DE RÉSINE, FILM ET PRODUIT DURCI
(JA) 樹脂組成物、膜、及び硬化物
Abstract
(EN) A resin composition that contains: a resin that has a polar group; and an insulating filler that, on a volume-based particle size distribution curve, has a particle size of no more than 5.0 μm at an accumulation of 50% from the smaller side and a particle size of no more than 10.0 μm at an accumulation of 90% from the smaller side. The insulating filler is at least 50 volume% of the total solid content of the resin composition.
(FR) L'invention concerne une composition de résine qui contient : une résine qui présente un groupe polaire ; et une charge isolante qui, sur une courbe de distribution de taille de particule basée sur le volume, a une taille de particule ne dépassant pas 5,0 µm à une accumulation de 50 % à partir du côté plus petit et une taille de particule ne dépassant pas 10,0 µm à une accumulation de 90 % à partir du côté plus petit. La charge isolante correspond à au moins 50 % en volume de la teneur totale en solides de la composition de résine.
(JA) 体積基準の粒度分布曲線において小径側からの累積が50%となるときの粒径が5.0μm以下であり、前記小径側からの累積が99%となるときの粒径が10.0μm以下である、絶縁性フィラーと、極性基を有する樹脂と、を含有する樹脂組成物であって、前記絶縁性フィラーの含有率が、前記樹脂組成物の全固形分に対して50体積%以上である、樹脂組成物。
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