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1. WO2022009886 - FINE METAL LINEAR BODY

Publication Number WO/2022/009886
Publication Date 13.01.2022
International Application No. PCT/JP2021/025476
International Filing Date 06.07.2021
IPC
B22F 9/24 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
9Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
16using chemical processes
18with reduction of metal compounds
24starting from liquid metal compounds, e.g. solutions
C25D 1/04 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1Electroforming
04Wires; Strips; Foils
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
B22F 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
Applicants
  • 三井金属鉱業株式会社 MITSUI MINING & SMELTING CO., LTD. [JP]/[JP]
Inventors
  • 薦田 康夫 KOMODA, Yasuo
  • 柴田 泰宏 SHIBATA, Yasuhiro
  • 清水 良憲 SHIMIZU, Yoshinori
  • 小澤 行弘 OZAWA, Ikuhiro
Agents
  • 特許業務法人翔和国際特許事務所 SHOWA INTERNATIONAL PATENT FIRM
Priority Data
2020-11766108.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) FINE METAL LINEAR BODY
(FR) CORPS LINÉAIRE MÉTALLIQUE FIN
(JA) 微細金属線状体
Abstract
(EN) Provided is a fine metal linear body having a lower sintering temperature than the conventional one. The fine metal linear body has a length of 0.5-200 µm and a thickness of 30 nm or more and 10 µm or less. Where the length of a metal crystal constituting the fine metal linear body along the extension direction of the fine metal linear body is denoted by X and the length along the direction orthogonal to said direction is denoted by Y, the value of X/Y, which is the ratio of X to Y, is 4 or less at three points in boundary regions obtained when the length of the fine metal linear body is divided into four equal parts along the extension direction thereof.
(FR) L'invention concerne un corps linéaire métallique fin présentant une température de frittage inférieure à celle du corps classique. Le corps linéaire métallique fin présente une longueur de 0,5 à 200 µm et une épaisseur de 30 nm ou plus et 10 µm ou moins. La longueur d'un cristal métallique constituant le corps linéaire métallique fin le long de la direction d'extension du corps linéaire métallique fin est désignée par X et la longueur le long de la direction orthogonale à ladite direction est désignée par Y, la valeur de X/Y, qui est le rapport de X à Y, est inférieure ou égale à 4 en trois points dans les régions limites obtenues lorsque la longueur du corps linéaire métallique fin est divisée en quatre parties égales le long de la direction d'extension de celui-ci.
(JA) 従来よりも焼結温度が低い微細金属線状体を提供すること。微細金属線状体は、長さが0.5μm以上200μm以下であり、太さが30nm以上10μm以下である。微細金属線状体を構成する金属の結晶について、該微細金属線状体の延びる方向に沿う長さをXとし、該方向と直交する方向に沿う長さをYとしたとき、該微細金属線状体をその延びる方向に沿って長さを四等分したときの境界域の三か所において、Yに対するXの比であるX/Yの値が4以下である。
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