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1. WO2022009846 - ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2022/009846
Publication Date 13.01.2022
International Application No. PCT/JP2021/025360
International Filing Date 05.07.2021
IPC
C09J 7/35 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
35Heat-activated
B32B 27/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
B32B 27/18 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
C08G 59/24 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
C08G 59/68 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68characterised by the catalysts used
C08G 65/18 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
CPC
B32B 27/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
B32B 27/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
18characterised by the use of special additives
C08G 59/24
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
C08G 59/68
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
68characterised by the catalysts used
C08G 65/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
C09J 4/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 成冨 和也 NARITOMI Kazuya
  • 中澤 孝 NAKAZAWA Takashi
  • 酒井 裕行 SAKAI Hiroyuki
  • 福井 将人 FUKUI Masato
  • 和泉田 融 IZUMITA Tohru
  • 稗島 華世 HIESHIMA Kayo
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 平野 裕之 HIRANO Hiroyuki
Priority Data
2020-11720307.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
(FR) FILM ADHÉSIF POUR CONNEXION DE CIRCUIT ET STRUCTURE DE CONNEXION DE CIRCUIT ET SON PROCÉDÉ DE FABRICATION
(JA) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
Abstract
(EN) Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer that contains electroconductive particles, a cured product of a photocurable resin component, and a first heat-curable resin component; and a second adhesive layer that is provided on the first adhesive layer and that contains a second heat-curable resin component. The minimum melt viscosity of the adhesive film for circuit connection is 450-1600 Pa∙s.
(FR) L'invention concerne un film adhésif pour connexion de circuit. Ce film adhésif pour connexion de circuit comprend : une première couche adhésive qui contient des particules électroconductrices, un produit durci d'un composant de résine photodurcissable, et un premier composant de résine thermodurcissable ; et une seconde couche adhésive qui est disposée sur la première couche adhésive et qui contient un second composant de résine thermodurcissable. La viscosité à l'état fondu minimale du film adhésif pour connexion de circuit est de 450 à 1 600 Pa∙s.
(JA) 回路接続用接着剤フィルムが開示される。当該回路接続用接着剤フィルムは、導電粒子、光硬化性樹脂成分の硬化物、及び第1の熱硬化性樹脂成分を含有する第1の接着剤層と、第1の接着剤層上に設けられた、第2の熱硬化性樹脂成分を含有する第2の接着剤層とを備える。回路接続用接着剤フィルムの最低溶融粘度は、450~1600Pa・sである。
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