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1. WO2022009782 - POLYBENZOXAZOLE, POLYAMIDE, POLYAMIDE SOLUTION, INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY EQUIPMENT, INSULATION MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING POLYAMIDE, METHOD FOR PRODUCING POLYBENZOXAZOLE, METHOD FOR PRODUCING INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, AND DIAMINE OR SALT THEREOF

Publication Number WO/2022/009782
Publication Date 13.01.2022
International Application No. PCT/JP2021/025005
International Filing Date 01.07.2021
IPC
C08G 73/22 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
22Polybenzoxazoles
B32B 27/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
B32B 27/18 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
B32B 27/34 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
34comprising polyamides
C07C 215/80 2006.1
CCHEMISTRY; METALLURGY
07ORGANIC CHEMISTRY
CACYCLIC OR CARBOCYCLIC COMPOUNDS
215Compounds containing amino and hydroxy groups bound to the same carbon skeleton
74having hydroxy groups and amino groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
76of the same non-condensed six-membered aromatic ring
80containing at least two amino groups bound to the carbon skeleton
H01B 3/30 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
30plastics; resins; waxes
Applicants
  • セントラル硝子株式会社 CENTRAL GLASS COMPANY, LIMITED [JP]/[JP]
Inventors
  • 村上 洋介 MURAKAMI Yosuke
  • 細井 健史 HOSOI Kenji
  • 江口 弘 EGUCHI Hiroshi
  • 萩原 祐樹 HAGIWARA Yuki
  • 山田 真輝 YAMADA Masaki
  • 山中 一広 YAMANAKA Kazuhiro
Agents
  • 速水 進治 HAYAMI Shinji
Priority Data
2020-11900110.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYBENZOXAZOLE, POLYAMIDE, POLYAMIDE SOLUTION, INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY EQUIPMENT, INSULATION MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING POLYAMIDE, METHOD FOR PRODUCING POLYBENZOXAZOLE, METHOD FOR PRODUCING INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, AND DIAMINE OR SALT THEREOF
(FR) POLYBENZOXAZOLE, POLYAMIDE, SOLUTION DE POLYAMIDE, ISOLANT POUR COMPOSANT ÉLECTRONIQUE HAUTE FRÉQUENCE, COMPOSANT ÉLECTRONIQUE HAUTE FRÉQUENCE, ÉQUIPEMENT HAUTE FRÉQUENCE, MATÉRIAU D'ISOLATION POUR LA PRODUCTION D'UN COMPOSANT ÉLECTRONIQUE À HAUTE FRÉQUENCE, PROCÉDÉ DE PRODUCTION DE POLYAMIDE, PROCÉDÉ DE PRODUCTION DE POLYBENZOXAZOLE, PROCÉDÉ DE PRODUCTION D'UNE ISOLATION POUR COMPOSANT ÉLECTRONIQUE HAUTE FRÉQUENCE, ET DIAMINE OU SEL DE CELLE-CI
(JA) ポリベンゾオキサゾール、ポリアミド、ポリアミド溶液、高周波電子部品用絶縁材、高周波電子部品、高周波機器、高周波電子部品製造用絶縁材料、ポリアミドの製造方法、ポリベンゾオキサゾールの製造方法、高周波電子部品用絶縁材の製造方法、および、ジアミンまたはその塩
Abstract
(EN) Polybenzoxazole having a structural unit represented by general formula [1]. In general formula [1], R1 is a tetravalent organic group represented by general formula [2], and R2 is a divalent organic group. In general formula [2]: the two n are each independently an integer of 0-3; R3, when more than one is present, each independently represent a monovalent substituent; *1, *2, *3, and *4 each independently represent a bonding partner; one of *1 and *2 bonds with an oxygen atom in general formula [1], and the other bonds with a nitrogen atom in general formula [1]; and one of *3 and *4 bonds with an oxygen atom in general formula [1], and the other bonds with a nitrogen atom in general formula [1].
(FR) La présente invention concerne un polybenzoxazole ayant une unité structurale représentée par la formule générale [1]. Dans la formule (1), R1 représente un groupe organique tétravalent représenté par la formule [2], et R2 représente un groupe organique divalent. Dans la formule générale [2] : les deux n sont chacun indépendamment un nombre entier de 0 à 3 ; chaque R3, lorsque plus d'un est présent, représente indépendamment un substituant monovalent ; * 1, * 2, * 3 et * 4 représentent chacun indépendamment un partenaire de liaison ; l'un de * 1 et * 2 se lie avec un atome d'oxygène dans la formule générale [1], et l'autre se lie avec un atome d'azote dans la formule générale [1] ; et l'un de * 3 et * 4 se lie avec un atome d'oxygène dans la formule générale [1], et l'autre se lie avec un atome d'azote dans la formule générale [1].
(JA) 一般式[1]で表される構造単位を有するポリベンゾオキサゾール。一般式[1]中、Rは一般式[2]で表される4価の有機基であり、Rは2価の有機基である。一般式[2]中、2つのnはそれぞれ独立して0~3の整数であり、Rは複数存在する場合はそれぞれ独立して1価の置換基を表し、*1、*2、*3および*4はそれぞれ独立に結合手を表し、*1および*2の一方は一般式[1]中の酸素原子と結合し、他方は一般式[1]中の窒素原子と結合し、*3および*4の一方は一般式[1]中の酸素原子と結合し、他方は一般式[1]中の窒素原子と結合する。
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