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1. WO2022009744 - POLYMER COMPOUND, AND RESIN COMPOSITION CONTAINING SAID COMPOUND

Publication Number WO/2022/009744
Publication Date 13.01.2022
International Application No. PCT/JP2021/024697
International Filing Date 30.06.2021
IPC
C08F 8/14 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Chemical modification by after-treatment
14Esterification
C09J 4/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C08F 212/08 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
212Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
02Monomers containing only one unsaturated aliphatic radical
04containing one ring
06Hydrocarbons
08Styrene
C08K 5/14 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
04Oxygen-containing compounds
14Peroxides
C08K 5/3415 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3412having one nitrogen atom in the ring
3415Five-membered rings
C08L 25/14 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02Homopolymers or copolymers of hydrocarbons
04Homopolymers or copolymers of styrene
08Copolymers of styrene
14with unsaturated esters
Applicants
  • 日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 赤塚 泰昌 AKATUKA Yasumasa
  • 林本 成生 HAYASHIMOTO Shigeo
Agents
  • 上村 陽一郎 KAMIMURA Yoichiro
Priority Data
2020-11841609.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYMER COMPOUND, AND RESIN COMPOSITION CONTAINING SAID COMPOUND
(FR) COMPOSÉ POLYMÈRE ET COMPOSITION DE RÉSINE CONTENANT LEDIT COMPOSÉ
(JA) 高分子化合物、及び該化合物を含む樹脂組成物
Abstract
(EN) This polymer compound is represented by formula (1) (in the formula, R1 and R2 each independently denote a hydrogen atom or a methyl group. m and n are average numbers of repeating units, and each independently denote a real number within the range of 1 to 2000). The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.
(FR) Ce composé polymère est représenté par la formule (1) (dans la formule, R1 et R2 représentent chacun indépendamment un atome d'hydrogène ou un groupe méthyle ; m et n représentent des nombres moyens d'unités de répétition, et représentent chacun indépendamment un nombre réel dans la plage de 1 à 2 000). Le composé polymère présente une flexibilité suffisante pour pouvoir former un film, présente une adhérence élevée sur une feuille de cuivre à faible rugosité, et présente une constante diélectrique et une tangente de perte diélectrique faibles.
(JA) 下記式(1)(式中、R及びRはそれぞれ独立に水素原子又はメチル基を表す。m及びnは繰り返し単位数の平均値であって、それぞれ独立に1乃至2,000の範囲にある実数を表す。)で表される高分子化合物は、フィルム化できるだけの十分なフレキシビリティーを有し、低粗度銅箔に対する接着性が高く、かつ誘電率及び誘電正接の低いものである。
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