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1. WO2022009676 - PHOTOSENSITIVE RESIN COMPOSITION AND CURED RESIN FILM OBTAINED THEREFROM

Publication Number WO/2022/009676
Publication Date 13.01.2022
International Application No. PCT/JP2021/023720
International Filing Date 23.06.2021
IPC
C08F 230/08 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
230Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium, or a metal
04containing a metal
08containing silicon
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
G03F 7/038 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/075 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
075Silicon-containing compounds
Applicants
  • 昭和電工株式会社 SHOWA DENKO K.K. [JP]/[JP]
Inventors
  • 周 正偉 ZHOU Zhengwei
  • 木下 健宏 KINOSHITA Takehiro
Agents
  • 及川 周 OIKAWA Shu
  • 荒 則彦 ARA Norihiko
  • 勝俣 智夫 KATSUMATA Tomoo
Priority Data
2020-11651806.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION AND CURED RESIN FILM OBTAINED THEREFROM
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE ET FILM DE RÉSINE DURCI OBTENU À PARTIR DE CELLE-CI
(JA) 感光性樹脂組成物及びその樹脂硬化膜
Abstract
(EN) Provided are a photosensitive resin composition having satisfactory developability and excellent low-temperature curability, a cured resin film obtained by curing the photosensitive resin composition, and an image display element including the cured resin film. This photosensitive resin composition comprises (A) a copolymer, (B) a photoacid generator, and (C) a solvent. The copolymer (A) is a copolymer comprising a constituent unit (a-1) derived from (A-1) a polymerizable unsaturated compound having an alkoxysilyl group and a constituent unit (a-2) derived from (A-2) a polymerizable unsaturated compound having an acid group. The content of the constituent unit (a-1) in all the constituent units of the copolymer (A) is 45-99 mol%.
(FR) L'invention concerne une composition de résine photosensible ayant une aptitude au développement satisfaisante et une excellente aptitude au durcissement à basse température, un film de résine durci obtenu par durcissement de la composition de résine photosensible, et un élément d'affichage d'image comprenant le film de résine durci. Ladite composition de résine photosensible comprend (A) un polymérisable, (B) un générateur photo-acide et (C) un solvant. Le copolymère (A) est un copolymère comprenant une unité constitutive (a-1) dérivée de (A-1) un composé insaturé polymérisable ayant un groupe alcoxysilyle et une unité constitutive (a-2) dérivée de (A-2) un composé insaturé polymérisable ayant un groupe acide. La teneur de l'unité constitutive (a-1) dans toutes les unités constitutives du copolymère (A) est de 45 à 99 % en moles.
(JA) 現像性が良好であるとともに、低温硬化性に優れた感光性樹脂組成物、感光性樹脂組成物を硬化させてなる樹脂硬化膜、及び樹脂硬化膜を具備する画像表示素子を提供する。本発明の感光性樹脂組成物は、(A)共重合体と、(B)光酸発生剤と、(C)溶剤とを含有する。(A)共重合体が、(A-1)アルコキシシリル基を有する重合性不飽和化合物由来の構成単位(a-1)と、(A-2)酸基を有する重合性不飽和化合物由来の構成単位(a-2)とを含む共重合体である。(A)共重合体における全構成単位中の前記構成単位(a-1)の含有量が、45~99モル%である。
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