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1. WO2022009591 - MOLD RELEASE FILM

Publication Number WO/2022/009591
Publication Date 13.01.2022
International Application No. PCT/JP2021/021751
International Filing Date 08.06.2021
IPC
B32B 27/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C09K 3/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
C09J 7/38 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
B32B 7/022 2019.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
022Mechanical properties
H05K 3/28 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 株式会社東京セロレーベル TOKYO CELLOLABEL LTD. [JP]/[JP]
Inventors
  • 古橋 拓樹 FURUHASHI Hiroki
  • 福井 昌史 FUKUI Masashi
Agents
  • 永田 元昭 NAGATA Motoaki
  • 大田 英司 OHTA Eiji
  • 西村 弘 NISHIMURA Hiroshi
  • 北村 吉章 KITAMURA Yoshiaki
  • 永田 良昭 NAGATA Yoshiaki
Priority Data
2020-11799908.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) MOLD RELEASE FILM
(FR) FILM DE DÉMOULAGE
(JA) 離型フィルム
Abstract
(EN) [Problem] The present invention addresses the problem of preventing contamination of a mold and the like even if the production of a flexible printed board is carried out in a high temperature range. [Solution] A mold release film 11 which is provided with a cushion layer 13 between two mold release resin layers 12, wherein the mold release resin layers 12 are configured from a thermoplastic resin that has a melting point of 250°C or higher. In addition, the cushion layer 13 is configured from a curable resin that has a crosslinked structure. The present invention uses a curable resin which has a storage elastic modulus after curing of 6 MPa or less at 23°C, and a storage elastic modulus after curing of 0.6 MPa or less at 300°C.
(FR) Le problème décrit par la présente invention vise à empêcher la contamination d'un moule et similaire même si la production d'une carte imprimée flexible est réalisée dans une plage de température élevée. La solution de l'invention porte sur un film de démoulage (11) qui est doté d'une couche de rembourrage (13) entre deux couches de démoulage en résine (12), les couches de démoulage en résine (12) étant conçues à partir d'une résine thermoplastique qui a un point de fusion supérieur ou égal à 250 °C. De plus, la couche de rembourrage (13) est conçue à partir d'une résine durcissable qui a une structure réticulée. La présente invention utilise une résine durcissable qui a un module d'élasticité de conservation après durcissement inférieur ou égal à 6 MPa à 23 °C, et un module d'élasticité de conservation après durcissement inférieur ou égal à 0,6 MPa à 300° C.
(JA) 【課題】フレキシブルプリント基板の製造を高温域で行っても金型等の汚染を引き起こすことがないようにする。 【解決手段】2つの離型樹脂層12の間にクッション層13を備えた離型フィルム11において、離型樹脂層12を融点が250℃以上の熱可塑性樹脂で構成する。また、クッション層13を、架橋構造を有する硬化性樹脂で構成する。硬化性樹脂には、硬化後の貯蔵弾性率が、23℃において6MPa以下であり、300℃において0.6MPa以下のものを使用する。
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