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1. WO2022009571 - INTEGRATED DICING DIE-BONDING FILM, DIE-BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Publication Number WO/2022/009571
Publication Date 13.01.2022
International Application No. PCT/JP2021/021053
International Filing Date 02.06.2021
IPC
C09J 11/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 163/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 201/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 21/301 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/25 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
22Plastics; Metallised plastics
25based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 板垣 圭 ITAGAKI Kei
  • 谷口 紘平 TANIGUCHI Kohei
  • 平本 祐也 HIRAMOTO Yuya
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 清水 義憲 SHIMIZU Yoshinori
  • 平野 裕之 HIRANO Hiroyuki
Priority Data
2020-11787508.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) INTEGRATED DICING DIE-BONDING FILM, DIE-BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) FILM INTÉGRÉ DE DÉCOUPAGE EN DÉS ET FIXATION DE PUCE, FILM DE FIXATION DE PUCE, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEURS
(JA) ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法
Abstract
(EN) Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the adhesive layer of the dicing tape. The die-bonding film contains: silver-containing particles that each have an oxide layer on the surface thereof; and a fluxing agent. The silver-containing particle content is 75 mass% or more based on the total amount of the die-bonding film.
(FR) L'invention fournit un film intégré de découpage en dés et fixation de puce. Ce film intégré de découpage en dés et fixation de puce est équipé : d'une bande de découpage en dés qui possède un substrat et une couche adhésive agencée sur ce substrat ; et d'un film de fixation de puce qui est disposé sur la couche adhésive de la bande de découpage en dés. Le film de fixation de puce comprend : des particules comprenant un argent qui possèdent une couche d'oxyde en surface ; et un agent de flux. La teneur en particules comprenant un argent est supérieure ou égale à 75% en masse, sur la base de la quantité totale du film de fixation de puce.
(JA) ダイシング・ダイボンディング一体型フィルムが開示される。当該ダイシング・ダイボンディング一体型フィルムは、基材と基材上に設けられた粘着層とを有するダイシングテープと、ダイシングテープの粘着層上に配置されたダイボンディングフィルムとを備える。ダイボンディングフィルムは、表面に酸化物層を有する銀含有粒子と、フラックス剤とを含有する。銀含有粒子の含有量は、ダイボンディングフィルムの全量を基準として、75質量%以上である。
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