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1. WO2022009486 - THERMALLY CONDUCTIVE SILICONE GEL COMPOSITION AND THERMALLY CONDUCTIVE SILICONE GEL SHEET AND METHOD FOR PRODUCING SAME

Publication Number WO/2022/009486
Publication Date 13.01.2022
International Application No. PCT/JP2021/012921
International Filing Date 26.03.2021
IPC
C08L 83/05 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
05containing silicon bound to hydrogen
C08L 83/07 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C08K 3/11 2018.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
10Metal compounds
11Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic System
C08K 3/22 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
CPC
C08K 3/11
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
10Metal compounds
11Compounds containing metals of Groups 4 to 10 or Groups 14 to 16 of the Periodic system
C08K 3/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08L 83/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
Applicants
  • 富士高分子工業株式会社 FUJI POLYMER INDUSTRIES CO., LTD. [JP]/[JP]
Inventors
  • 片石拓海 KATAISHI Takumi
  • 杉江舞 SUGIE Mai
  • 木村裕子 KIMURA Yuko
Agents
  • 特許業務法人池内アンドパートナーズ IKEUCHI & PARTNERS
Priority Data
2020-11728507.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMALLY CONDUCTIVE SILICONE GEL COMPOSITION AND THERMALLY CONDUCTIVE SILICONE GEL SHEET AND METHOD FOR PRODUCING SAME
(FR) COMPOSITION DE GEL DE SILICONE THERMOCONDUCTEUR ET FEUILLE DE GEL DE SILICONE THERMOCONDUCTEUR ET LEUR PROCÉDÉ DE PRODUCTION
(JA) 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
Abstract
(EN) A thermally conductive silicone gel composition according to the present invention contains the following components A to D. A : a straight-chain organopolysiloxane that contains one vinyl group at each of the two terminals of the molecular chain and that has a kinematic viscosity of 1-600 mm2/s; B : a straight-chain organopolysiloxane that contains at least three Si-H groups in each molecule and has an Si-H group content of 0.05-6 mol/kg, in an amount that provides number of Si-H groups in component B/number of vinyl groups in component A = 0.2-0.5; C : a platinum catalyst in a catalytic amount; and D : a thermally conductive filler at 300-1,000 mass parts per 100 mass parts of the total amount of A and B.
(FR) Une composition de gel de silicone thermoconducteur selon la présente invention contient les composants A à D. A : un organopolysiloxane à chaîne linéaire qui contient un groupe vinyle à chacune des deux extrémités terminales de la chaîne moléculaire et qui présente une viscosité cinématique variant de 1 à 600 mm2/s ; B : un organopolysiloxane à chaîne linéaire qui contient au moins trois groupes Si-H dans chaque molécule et qui présente une teneur en groupes Si-H variant de 0,05 à 6 mol/kg, en quantité suffisante pour que le rapport : nombre de groupes Si-H dans le composant B/nombre de groupes vinyle dans le composant A = 0,2 à 0,5 ; C : un catalyseur au platine en quantité catalytique ; et D : une charge thermoconductrice à raison de 300 à 1 000 parties en masse pour 100 parties en masse de la quantité totale de A et B.
(JA) 本発明の熱伝導性シリコーンゲル組成物は、下記A~D成分を含む。A:分子鎖の両末端にビニル基を各1個有し、動粘度が1~600mm2/sの直鎖状オルガノポリシロキサン、B:Si-H基が1分子中に3個以上存在し、かつSi-H基の含有量が0.05~6mol/kgである直鎖状オルガノポリシロキサン:B成分中のSi-H基数/A成分中のビニル基数=0.2~0.5となる量、C:白金触媒:触媒量、D:熱伝導性充填剤:AとBの合計量を100質量部としたとき300~1000質量部
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