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1. WO2022009456 - EXPOSURE DEVICE

Publication Number WO/2022/009456
Publication Date 13.01.2022
International Application No. PCT/JP2021/004524
International Filing Date 08.02.2021
IPC
G03F 9/00 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 7/20 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/22
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
22Exposing sequentially with the same light pattern different positions of the same surface
G03F 9/00
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Applicants
  • 株式会社 ベアック BEAC CO., LTD. [JP]/[JP]
Inventors
  • 羽生 慎一 HANYU, Shinichi
  • 河東 和彦 KATO, Kazuhiko
Agents
  • めぶき国際特許業務法人 MEBUKI IP LAW FIRM
  • 松尾 誠剛 MATSUO, Nobutaka
Priority Data
2020-11607906.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) EXPOSURE DEVICE
(FR) DISPOSITIF D'EXPOSITION
(JA) 露光装置
Abstract
(EN) This exposure device divides a plurality of exposure target areas arranged along the direction of feeding the substrate 10 into a first exposure target area 22A and a second exposure target area 22B with a division line of a given shape, and exposes the target areas with light using a first photomask 20A and a second photomask 20B corresponding to the respective target areas. The exposure device is provided with an exposure stage 25, a substrate feeding mechanism 27, an alignment mechanism 28, and an exposure light radiation mechanism 30, and is configured such that, in a first operation mode, exposure is performed by using the first photomask 20A while the exposure target area 22A is being fed in a forward direction, and in a second operation mode, exposure is performed by using the second photomasks 20B, while the exposure target area 22B is being fed in the opposite direction. It is possible to reduce cost for photomasks, highly accurately transfer mask patterns to a large-sized substrate, and increase productivity even in a division exposure method.
(FR) La présente invention concerne un dispositif d'exposition qui divise une pluralité de zones cibles d'exposition disposées le long de la direction d'insertion du substrat 10 dans une première zone cible d'exposition 22A et dans une seconde zone cible d'exposition 22B avec une ligne de division ayant une forme donnée, et qui expose les zones cibles à la lumière à l'aide d'un premier photomasque 20A et d'un second photomasque 20B correspondant aux zones cibles respectives. Le dispositif d'exposition est pourvu d'une platine d'exposition 25, d'un mécanisme d'insertion de substrat 27, d'un mécanisme d'alignement 28 et d'un mécanisme de rayonnement de lumière d'exposition 30, et il est conçu de telle sorte que, dans un premier mode de fonctionnement, l'exposition est effectuée à l'aide du premier photomasque 20A tandis que la zone cible d'exposition 22A est alimentée dans une direction avant, et, dans un second mode de fonctionnement, l'exposition est effectuée à l'aide du second photomasque 20B tandis que la zone cible d'exposition 22B est alimentée dans la direction opposée. Il est possible de réduire les coûts pour les photomasques, de transférer de manière très précise des motifs de masque sur un substrat de grande taille, et d'augmenter la productivité même dans un procédé d'exposition par division.
(JA) 露光装置は、基板10の送り方向に配置される複数の各露光対象領域を任意形状の分割線で第1露光対象領域22A及び第2露光対象領域22Bに分割し、各対象領域に対応する第1フォトマスク20A及び第2フォトマスク20Bを使用して露光する露光装置であって、露光ステージ25と、基板送り機構27と、アライメント機構28と、露光光照射機構30と、を備え、第1の動作モードでは、露光対象領域22Aを順方向に送りながら第1フォトマスク20Aで露光を行い、第2の動作モードでは、露光対象領域22Bを逆方向に送りながら第2フォトマスク20Bで露光を行うよう構成されている。フォトマスクのコストを低減し、かつ、マスクパターンを大判サイズの基板に高精度に転写し、分割露光方式であっても生産性を高めることが可能となる。
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