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1. WO2022008792 - QUANTUM COMPUTING CIRCUIT COMPRISING A PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME

Publication Number WO/2022/008792
Publication Date 13.01.2022
International Application No. PCT/FI2021/050516
International Filing Date 02.07.2021
IPC
H01L 21/768 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
768Applying interconnections to be used for carrying current between separate components within a device
H01L 27/18 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
18including components exhibiting superconductivity
H01L 25/065 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
H01L 39/22 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
39Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
22Devices comprising a junction of dissimilar materials, e.g. Josephson-effect devices
B82Y 40/00 2011.1
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE  OR TREATMENT OF NANOSTRUCTURES
40Manufacture or treatment of nanostructures
B82Y 10/00 2011.1
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE  OR TREATMENT OF NANOSTRUCTURES
10Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
Applicants
  • IQM FINLAND OY [FI]/[FI]
Inventors
  • HASSEL, Juha
  • LIU, Wei
  • SEVRIUK, Vasilii
  • HEINSOO, Johannes
  • JENEI, Mate
  • VENKATESH, Manjunath
  • LI, Tianyi
  • CHAN, Kok Wai
  • TAN, Kuan Yen
  • MÖTTÖNEN, Mikko
Agents
  • PAPULA OY
Priority Data
20185005.409.07.2020EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) QUANTUM COMPUTING CIRCUIT COMPRISING A PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME
(FR) CIRCUIT DE CALCUL QUANTIQUE COMPRENANT UNE PLURALITÉ DE PUCES ET PROCÉDÉ DESTINÉ À LE FABRIQUER
Abstract
(EN) A quantum computing circuit comprises a first chip (301), with at least one qubit (303) thereon, and a second chip (302), with at least other quantum circuit element (304) than qubit thereon. Said first chip (301) and said second chip (302) are stacked together in a flip-chip configuration and attached to each other with bump bonding (3035) that comprises bonding bumps (403, 504).
(FR) L’invention concerne un circuit de calcul quantique qui comprend une première puce (301), sur laquelle est situé au moins un bit quantique (303), et une deuxième puce (302), sur laquelle est situé au moins un élément de circuit quantique (304) autre qu’un bit quantique. Ladite première puce (301) et ladite deuxième puce (302) sont empilées ensemble selon une configuration de puce retournée et fixées l’une à l’autre par un soudage par billes (3035) qui comprend des billes de soudure (403, 504).
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