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1. WO2022008771 - METHOD AND SYSTEM FOR ADHESIVE BONDING OF SUBSTRATES

Publication Number WO/2022/008771
Publication Date 13.01.2022
International Application No. PCT/ES2021/070454
International Filing Date 18.06.2021
IPC
B29C 65/48 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
48using adhesives
B05D 3/06 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
06by exposure to radiation
B29C 35/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
02Heating or curing, e.g. crosslinking or vulcanising
08by wave energy or particle radiation
Applicants
  • BARBERAN LATORRE, Jesús Francisco [ES]/[ES]
Inventors
  • BARBERAN LATORRE, Jesús Francisco
Agents
  • VEIGA SERRANO, Mikel
Priority Data
EP20382607.807.07.2020EP
Publication Language Spanish (es)
Filing Language Spanish (ES)
Designated States
Title
(EN) METHOD AND SYSTEM FOR ADHESIVE BONDING OF SUBSTRATES
(ES) PROCEDIMIENTO Y SISTEMA DE UNIÓN ADHESIVA DE SUSTRATOS
(FR) PROCÉDÉ ET SYSTÈME DE LIAISON ADHÉSIVE DE SUBSTRATS
Abstract
(EN) Disclosed is a method for the adhesive bonding of substrates, which comprises: applying a layer of adhesive (1) on a first substrate and/or on a second substrate; and positioning the first substrate on the second substrate, with the applied layer of adhesive (1) arranged therebetween. The method further comprises, before positioning the first substrate on the second substrate, applying radiation-based curing means (13) to the layer of adhesive (1) to selectively and partially cure the layer of adhesive (1).
(ES) Procedimiento de unión adhesiva de sustratos. El procedimiento comprende: aplicar una capa de adhesivo (1) sobre un primer sustrato y/o sobre un segundo sustrato; y posicionar el primer sustrato sobre el segundo sustrato, con interposición de la capa de adhesivo (1) aplicada. El procedimiento comprende, con anterioridad a posicionar el primer sustrato sobre el segundo sustrato, aplicar medios de curado (13) por radiación sobre la capa de adhesivo (1) para curar de forma seleccionada parcialmente dicha capa de adhesivo (1).
(FR) La présente invention concerne un procédé de liaison adhésive de substrats. Le procédé consiste à appliquer une couche d'adhésif (1) sur un premier substrat et/ou un second substrat; et positionner le premier substrat sur le second substrat, avec la couche d'adhésif (1) appliquée intercalée. Le procédé comprend, avant le positionnement du premier substrat sur le second substrat, l'application de moyens de polymérisation (13) par rayonnement sur la couche d'adhésif (1) pour polymériser de manière sélectionnée et partielle ladite couche d'adhésif (1).
Latest bibliographic data on file with the International Bureau