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1. WO2022008439 - A METHOD FOR MANUFACTURING COPPER FILM ON POROUS ALUMINUM OXIDE (PAO) ON AN ALUMINUM ALLOY SUBSTRATE

Publication Number WO/2022/008439
Publication Date 13.01.2022
International Application No. PCT/EP2021/068507
International Filing Date 05.07.2021
IPC
C25D 5/44 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34Pretreatment of metallic surfaces to be electroplated
42of light metals
44Aluminium
C25D 11/02 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
C25D 11/04 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
C25D 11/12 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
12Anodising more than once, e.g. in different baths
C25D 11/20 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
18After-treatment, e.g. pore-sealing
20Electrolytic after-treatment
C25D 11/24 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11Electrolytic coating by surface reaction, i.e. forming conversion layers
02Anodisation
04of aluminium or alloys based thereon
18After-treatment, e.g. pore-sealing
24Chemical after-treatment
Applicants
  • SYDDANSK UNIVERSITET [DK]/[DK]
Inventors
  • MORGEN, Per
Agents
  • PLOUGMANN VINGTOFT A/S
Priority Data
20184136.806.07.2020EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) A METHOD FOR MANUFACTURING COPPER FILM ON POROUS ALUMINUM OXIDE (PAO) ON AN ALUMINUM ALLOY SUBSTRATE
(FR) PROCÉDÉ DE FABRICATION DE FILM DE CUIVRE SUR UN OXYDE D’ALUMINIUM POREUX (OAP) SUR UN SUBSTRAT EN ALLIAGE D’ALUMINIUM
Abstract
(EN) The invention relates to process for manufacturing a thin and stable copper film on a porous aluminum oxide (PAO) film on an aluminum alloy substrate. Initially, anodization of the aluminum alloy substrate results in a regularly ordered PAO film; and subsequently there is electrodeposited copper on this PAO/aluminum substrate, the electrodepositing comprises the use of direct current (DC), preferably 10-15 V, so as to deposit metallic copper both: 1) in the open pores of the regularly ordered PAO film, and 2) on the top of the regularly ordered PAO film, so as to form a copper film on top of the PAO film. The anodization is performed so as to improve the adhesion and electrochemical corrosion stability i.e. with no, or little, galvanic corrosion of the electrodeposited copper on the PAO/aluminum substrate. The copper coverage is substantially continuous on the PAO/aluminum substrate.
(FR) La présente invention concerne un procédé de fabrication d’un film de cuivre mince et stable sur un film d’oxyde d’aluminium poreux (OAP) sur un substrat en alliage d’aluminium. Initialement, l’anodisation du substrat en alliage d’aluminium conduit à un film d’OAP régulièrement ordonné ; et ensuite du cuivre est électrodéposé sur ce substrat d’OAP/aluminium, l’électrodéposition comprenant l’utilisation d’un courant continu (CC), de préférence 10-15 V, de façon à déposer du cuivre métallique à la fois : 1) dans les pores ouverts du film d’OAP régulièrement ordonné, et 2) sur la partie supérieure du film d’OAP régulièrement ordonné, de façon à former un film de cuivre au-dessus du film d’OAP. L’anodisation est effectuée de façon à améliorer l’adhérence et la stabilité à la corrosion électrochimique, c’est-à-dire sans aucune, ou avec une faible corrosion galvanique du cuivre électrodéposé sur le substrat d’OAP/aluminium. La couverture de cuivre est sensiblement continue sur le substrat d’OAP/aluminium.
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