Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 25.01.2022 at 9:00 AM CET
Settings

Settings

Goto Application

1. WO2022008323 - STRUCTURES AND METHODS FOR ELECTRICALLY CONNECTING PRINTED HORIZONTAL DEVICES

Publication Number WO/2022/008323
Publication Date 13.01.2022
International Application No. PCT/EP2021/068067
International Filing Date 30.06.2021
IPC
H05K 1/11 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/40 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 1/14 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H05K 3/30 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/36 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
Applicants
  • X DISPLAY COMPANY TECHNOLOGY LIMITED [IE]/[IE]
Inventors
  • BOWER, Christopher Andrew
  • COK, Ronald S.
Agents
  • GRAHAM WATT & CO LLP
Priority Data
17/006,67428.08.2020US
63/050,73210.07.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) STRUCTURES AND METHODS FOR ELECTRICALLY CONNECTING PRINTED HORIZONTAL DEVICES
(FR) STRUCTURES ET PROCÉDÉS POUR CONNECTER ÉLECTRIQUEMENT DES DISPOSITIFS HORIZONTAUX IMPRIMÉS
Abstract
(EN) A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.
(FR) La présente invention concerne une structure imprimée qui comprend un dispositif comprenant des contacts électriques de dispositif disposés sur un côté commun du dispositif et un substrat non natif au dispositif comprenant des contacts électriques de substrat disposés sur une surface du substrat. Au moins l'un des contacts électriques de substrat a une forme arrondie. Les contacts électriques de dispositif sont en contact physique et électrique avec des contacts électriques de substrat correspondants. Les contacts électriques de substrat peuvent comprendre un noyau polymère revêtu d'un conducteur électrique de contact à motifs sur une surface du noyau polymère. La présente invention concerne également un procédé de fabrication de noyaux polymères comprenant la formation d'un motif sur un polymère sur le substrat et la refusion du polymère à motifs pour former une ou plusieurs formes arrondies du polymère ainsi que l'application d'un revêtement, puis la formation d'un motif sur la ou les formes arrondies avec un matériau conducteur.
Related patent documents
Latest bibliographic data on file with the International Bureau