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1. WO2022007275 - EMBEDDED CIRCUIT BOARD MANUFACTURING METHOD, EMBEDDED CIRCUIT BOARD, AND APPLICATION

Publication Number WO/2022/007275
Publication Date 13.01.2022
International Application No. PCT/CN2020/127018
International Filing Date 06.11.2020
IPC
H05K 3/22 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
H05K 3/40 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 1/11 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
Applicants
  • 深南电路股份有限公司 SHENNAN CIRCUITS CO., LTD. [CN]/[CN]
Inventors
  • 黄立湘 HUANG, Lixiang
  • 王泽东 WANG, Zedong
  • 缪桦 MIAO, Hua
Agents
  • 深圳市威世博知识产权代理事务所(普通合伙) CHINA WISPRO INTELLECTUAL PROPERTY LLP.
Priority Data
202010645946.907.07.2020CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) EMBEDDED CIRCUIT BOARD MANUFACTURING METHOD, EMBEDDED CIRCUIT BOARD, AND APPLICATION
(FR) PROCÉDÉ DE FABRICATION DE CIRCUIT IMPRIMÉ INTÉGRÉ, CIRCUIT IMPRIMÉ INTÉGRÉ ET APPLICATION
(ZH) 埋入式电路板的制造方法、埋入式电路板以及应用
Abstract
(EN) An embedded circuit board (100) and a manufacturing method therefor. The method comprises the following steps: step S10, providing a substrate (10), wherein an electronic device (20) is embedded into the substrate (10), a side surface of the electronic device (20) is provided with a pad (40), and the end surface of the pad (40) is flush with the surface, on the same side, of the substrate (10); step S20, forming a metal layer (30) on the side surface of the substrate (10) close to the pad (40); and step S30, patterning the metal layer (30) to obtain the circuit board (100) in which the pad (40) is covered with the metal layer (30), wherein the metal layer (30) on the pad (40) protrudes from the surface, on the same side, of the substrate (10). By means of the method, the pad (40) on the substrate (10) can be subjected to secondary processing according to the requirements of users, and thus the embedded circuit board (100) satisfying different product performance requirements of users is manufactured.
(FR) Circuit imprimé intégré (100) et son procédé de fabrication. Le procédé comprend les étapes consistant à : étape S10, fournir un substrat (10), un dispositif électronique (20) étant intégré dans le substrat (10), une surface latérale du dispositif électronique (20) étant dotée d'un tampon (40) et la surface d'extrémité du tampon (40) dépassant de la surface du substrat (10), sur le même côté ; étape S20, former une couche métallique (30) sur la surface latérale du substrat (10) à proximité du tampon (40) ; et étape S30, former des motifs sur la couche métallique (30) pour obtenir le circuit imprimé (100) dans laquelle le tampon (40) est recouvert de la couche métallique (30), la couche métallique (30) sur le tampon (40) dépassant de la surface du substrat (10), sur le même côté. Au moyen du procédé, le tampon (40) sur le substrat (10) peut être soumis à un traitement secondaire selon les exigences des utilisateurs, un circuit imprimé (100) intégré satisfaisant différentes exigences de performance de produit des utilisateurs étant ainsi fabriqué.
(ZH) 一种埋入式电路板(100)及其制造方法,该方法包括以下步骤:步骤S10,提供一基板(10),基板(10)中嵌设有一电子器件(20),其中,电子器件(20)的一侧表面上设置有焊盘(40),焊盘(40)端面与基板(10)的同侧表面平齐;步骤S20,在基板(10)靠近焊盘(40)的一侧表面形成金属层(30);步骤S30,对金属层(30)进行图案化,以得到焊盘(40)上覆盖有金属层(30)的电路板(100),其中焊盘(40)上的金属层(30)突出于基板(10)的同侧表面。通过上述方式,能够根据用户要求对基板(10)上的焊盘(40)进行二次加工,进而制造出满足用户不同的产品性能要求的埋入式电路板(100)。
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EP2020827991This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
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