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1. WO2022007271 - CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2022/007271
Publication Date 13.01.2022
International Application No. PCT/CN2020/127013
International Filing Date 06.11.2020
IPC
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 1/11 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 3/42 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
H05K 3/30 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
Applicants
  • 深南电路股份有限公司 SHENNAN CIRCUITS CO., LTD. [CN]/[CN]
Inventors
  • 黄立湘 HUANG, Lixiang
  • 王泽东 WANG, Zedong
  • 缪桦 MIAO, Hua
Agents
  • 深圳市威世博知识产权代理事务所(普通合伙) CHINA WISPRO INTELLECTUAL PROPERTY LLP.
Priority Data
202010645387.107.07.2020CN
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
(FR) CARTE DE CIRCUIT IMPRIMÉ ET SON PROCÉDÉ DE FABRICATION
(ZH) 线路板及其制作方法
Abstract
(EN) A circuit board and a manufacturing method therefor. The circuit board comprises a circuit board (11, 21, 41, 51, 61, 71), an embedded element (12, 22, 42, 52, 62, 72), and an attachment element (13, 23, 43, 53, 63, 73), wherein the circuit board (11, 21, 41, 51, 61, 71) is provided with a recess; the embedded element (12, 22, 42, 52, 62, 72) is disposed in the recess; and the attachment element (13, 23, 43, 53, 63, 73) is disposed on at least one surface of the circuit board (11, 21, 41, 51, 61, 71), and is electrically connected to the embedded element (12, 22, 42, 52, 62, 72). A device with a larger volume is disposed inside the circuit board, thereby reducing the volume of the product.
(FR) L'invention concerne une carte de circuit imprimé et son procédé de fabrication. La carte de circuit imprimé comprend une carte de circuit imprimé (11, 21, 41, 51, 61, 71), un élément intégré (12, 22, 42, 52, 62, 72), et un élément de fixation (13, 23, 43, 53, 63, 73), la carte de circuit imprimé (11, 21, 41, 51, 61, 71) étant pourvue d'un évidement ; l'élément intégré (12, 22, 42, 52, 62, 72) est disposé dans l'évidement ; et l'élément de fixation (13, 23, 43, 53, 63, 73) est disposé sur au moins une surface de la carte de circuit imprimé (11, 21, 41, 51, 61, 71), et est électriquement connecté à l'élément intégré (12, 22, 42, 52, 62, 72). Un dispositif ayant un volume plus grand est disposé à l'intérieur de la carte de circuit imprimé, réduisant ainsi le volume du produit.
(ZH) 一种线路板及其制作方法,所述线路板包括:线路板(11、21、41、51、61、71)、嵌入式元件(12、22、42、52、62、72)、贴附元件(13、23、43、53、63、73)。其中,线路板(11、21、41、51、61、71)上开设有槽体,嵌入式元件(12、22、42、52、62、72)设置在槽体内,贴附元件(13、23、43、53、63、73)设置在线路板(11、21、41、51、61、71)的至少一表面上,并与嵌入式元件(12、22、42、52、62、72)电连接。以此将体积较大的器件设置在线路板内部,以此减小产品的体积。
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