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1. WO2022006785 - METHOD FOR PREPARING CIRCUIT BOARD

Publication Number WO/2022/006785
Publication Date 13.01.2022
International Application No. PCT/CN2020/100907
International Filing Date 08.07.2020
IPC
H05K 3/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
B29C 64/135 2017.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
64Additive manufacturing, i.e. manufacturing of three-dimensional objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
10Processes of additive manufacturing
106using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
124using layers of liquid which are selectively solidified
129characterised by the energy source therefor, e.g. by global irradiation combined with a mask
135the energy source being concentrated, e.g. scanning lasers or focused light sources
B33Y 10/00 2015.1
BPERFORMING OPERATIONS; TRANSPORTING
33ADDITIVE MANUFACTURING TECHNOLOGY
YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
10Processes of additive manufacturing
Applicants
  • 广东工业大学 GUANGDONG UNIVERSITY OF TECHNOLOGY [CN]/[CN]
Inventors
  • 王成勇 WANG, Chengyong
  • 郭紫莹 GUO, Ziying
  • 刘志华 LIU, Zhihua
  • 姚俊雄 YAO, Junxiong
Agents
  • 广州市时代知识产权代理事务所(普通合伙) GUANGZHOU SHIDAI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP)
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) METHOD FOR PREPARING CIRCUIT BOARD
(FR) PROCÉDÉ DE PRÉPARATION DE CARTE DE CIRCUIT IMPRIMÉ
(ZH) 一种电路板的制备方法
Abstract
(EN) Disclosed is a method for preparing a circuit board. The method comprises the following steps: (1) obtaining an insulating part structure that has a cavity by using 3D drawing software, wherein the structure of the cavity is identical to a circuit wiring structure; (2) printing the insulating part structure by using 3D printing technology; (3) coating the insulating part structure with conductive ink; and (4) curing the conductive ink in the cavity structure. The preparation method has a low operation technical difficulty, simpler equipment and a low cost, and the defects of bending, infirm connection or scorching caused by differences in material performances such as a thermal expansion coefficient during layer-by-layer printing of an insulating layer and a conductive layer can be prevented.
(FR) Un procédé de préparation d'une carte de circuit imprimé est divulgué. Le procédé comprend les étapes suivantes consistant à : (1) obtenir une structure d'élément isolant pourvue d'une cavité au moyen d'un logiciel de dessin 3D, la structure de la cavité étant identique à une structure de câblage de circuit ; (2) imprimer la structure d'élément isolant au moyen d'une technologie d'impression 3D ; (3) revêtir la structure d'élément isolant d'encre conductrice ; et (4) durcir l'encre conductrice dans la structure de cavité. Le procédé de préparation présente une faible difficulté technique de fonctionnement, un équipement plus simple et un faible coût ; et permet la prévention des défauts de courbure, de connexion déficiente ou de vulcanisation prématurée dus à des différences de performances entre matériaux, telles qu'un coefficient de dilatation thermique, pendant l'impression couche par couche d'une couche isolante et d'une couche conductrice.
(ZH) 本发明公开一种电路板的制备方法,包括以下步骤:(1)使用3D画图软件获得带有空腔的绝缘部分结构,所述空腔的结构与电路布线结构相同;(2)利用3D打印技术打印所述绝缘部分结构;(3)利用导电油墨对所述绝缘部分结构进行涂履处理;(4)将导电油墨固化在空腔结构中,该制备方法不仅操作技术难度小,设备更加简单和价格低廉,同时还能避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦的缺陷。
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