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1. WO2022006390 - COPPER-ANF COMPOSITE CONDUCTOR FABRICATION

Publication Number WO/2022/006390
Publication Date 06.01.2022
International Application No. PCT/US2021/040078
International Filing Date 01.07.2021
IPC
B05D 3/06 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
3Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
06by exposure to radiation
B29B 9/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
9Making granules
C09D 11/02 2014.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
02Printing inks
CPC
B29B 7/90
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
7Mixing; Kneading
80Component parts, details or accessories; Auxiliary operations
88Adding charges ; , i.e. additives
90Fillers or reinforcements ; , e.g. fibres
H01B 1/026
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
026Alloys based on copper
Applicants
  • THE REGENTS OF THE UNIVERSITY OF MICHIGAN [US]/[US]
Inventors
  • HAMMIG, Mark
  • KOTOV, Nicholas
  • LYU, Jing
  • JOGLEKAR, Suneel
Agents
  • BRAIDWOOD, G., Christopher
Priority Data
63/046,92001.07.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) COPPER-ANF COMPOSITE CONDUCTOR FABRICATION
(FR) FABRICATION DE CONDUCTEUR COMPOSITE CUIVRE-ANF
Abstract
(EN) A method of fabricating a conductor includes preparing an aramid nanofiber solution in which a matrix of aramid nanofibers is dispersed, preparing a dispersion of copper nanoparticles, each copper nanoparticle of the dispersion of cooper nanoparticles having an organic capping ligand attached to the copper nanoparticle, and incorporating copper nanoparticles of the dispersion of copper nanoparticies into the matrix of aramid nanofibers such that each incorporated copper nanoparticle is bonded to a respective aramid nanofiber of the matrix of aramid nanofibers via the organic capping ligand to which the copper nanoparticle is attached. The organic capping ligand may include a mercaptocarboxyiic acid.
(FR) Un procédé de fabrication d'un conducteur comprend la préparation d'une solution de nanofibres d'aramide dans laquelle est dispersée une matrice de nanofibres d'aramide, la préparation d'une dispersion de nanoparticules de cuivre, chaque nanoparticule de cuivre de la dispersion de nanoparticules de cuivre ayant un ligand de coiffage organique fixé à la nanoparticule de cuivre, et l'incorporation de nanoparticules de cuivre de la dispersion de nanoparticules de cuivre dans la matrice de nanofibres d'aramide de sorte que chaque nanoparticule de cuivre incorporée soit liée à une nanofibre d'aramide respective de la matrice de nanofibres d'aramide par l'intermédiaire du ligand de coiffage organique auquel est fixée la nanoparticule de cuivre. Le ligand de coiffage organique peut comprendre un acide mercaptocarboxylique.
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