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1. WO2022006161 - SPM PROCESSING OF SUBSTRATES

Publication Number WO/2022/006161
Publication Date 06.01.2022
International Application No. PCT/US2021/039692
International Filing Date 29.06.2021
IPC
H01L 21/67 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/687 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
H01L 21/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • BROWN, Brian J.
  • MIKHAYLICHENKO, Ekaterina A.
  • KIRKPATRICK, Brian K.
Agents
  • GOREN, David J.
Priority Data
17/346,10811.06.2021US
63/046,57130.06.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) SPM PROCESSING OF SUBSTRATES
(FR) TRAITEMENT SPM DE SUBSTRATS
Abstract
(EN) A substrate cleaning system to remove particulates from multiple substrates includes a first container for applying a cleaning liquid to substrates, a second container for applying a rinsing liquid to substrates, and a robot system. The first container includes at least two openable and closable access ports in a top of the first container and a plurality of supports to hold the substrates at respective edges in the first container. The second container has a plurality of supports to hold the substrates at respective edges in the second container. The robot system transports substrates through the at least two openable and closable access ports in the top of the first container, and transports substrates through a top of the second container.
(FR) Un système de nettoyage de substrat destiné à éliminer des particules de multiples substrats comprend un premier récipient pour appliquer un liquide de nettoyage à des substrats, un second récipient pour appliquer un liquide de rinçage à des substrats et un système robotisé. Le premier récipient comprend au moins deux orifices d'accès pouvant être ouverts et fermés dans une partie supérieure du premier récipient et une pluralité de supports pour maintenir les substrats au niveau de bords respectifs dans le premier récipient. Le second récipient comporte une pluralité de supports pour maintenir les substrats au niveau de bords respectifs dans le second récipient. Le système robotisé transporte des substrats à travers les au moins deux orifices d'accès pouvant être ouverts et fermés dans la partie supérieure du premier récipient, et transporte des substrats à travers une partie supérieure du second récipient.
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