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1. WO2022005669 - FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

Publication Number WO/2022/005669
Publication Date 06.01.2022
International Application No. PCT/US2021/034862
International Filing Date 28.05.2021
IPC
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/498 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
Applicants
  • QUALCOMM INCORPORATED [US]/[US]
Inventors
  • SUN, Yangyang
  • HE, Dongming
  • ZHAO, Lily
Agents
  • OLDS, Mark E.
Priority Data
16/917,29530.06.2020US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
(FR) TAILLE DE MÉTALLISATION SOUS BOSSE DE PUCE RETOURNÉE SOUPLE
Abstract
(EN) Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.
(FR) Un dispositif à puce retournée est divulgué. Le dispositif à puce retournée comprend une matrice ayant une pluralité de métallisations sous bosse (UBM) ; et un substrat de paquet ayant une pluralité de plots de connexion. La pluralité d'UBM comprend un premier ensemble d'UBM ayant une première taille et un premier pas minimal et un second ensemble d'UBM ayant une seconde taille et un second pas minimal. Le premier ensemble d'UBM et le second ensemble d'UBM sont chacun électriquement couplés au substrat de paquet par une liaison de connexion sur plot.
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