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1. WO2022005245 - PRINTED CIRCUIT BOARD ASSEMBLY WITH SOLDERING STRUCTURE

Publication Number WO/2022/005245
Publication Date 06.01.2022
International Application No. PCT/KR2021/008416
International Filing Date 02.07.2021
IPC
H05K 1/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/34 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
H01P 3/12 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
12Hollow waveguides
Applicants
  • 주식회사 케이엠더블유 KMW INC. [KR]/[KR]
Inventors
  • 박남신 PARK, Nam Shin
  • 노양필 ROH, Yang Pill
  • 김재홍 KIM, Jae Hong
  • 오민욱 OH, Min Wook
  • 신연호 SHIN, Yeon Ho
  • 강재원 KANG, Jae Won
  • 김동현 KIM, Dong Hyun
  • 김훈 KIM, Hoon
Agents
  • 수안특허법인 SUAN INTELLECTUAL PROPERTY
Priority Data
10-2020-008172902.07.2020KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) PRINTED CIRCUIT BOARD ASSEMBLY WITH SOLDERING STRUCTURE
(FR) ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ AVEC STRUCTURE DE BRASAGE
(KO) 솔더 기판 조립체
Abstract
(EN) The present invention relates to a printed circuit board assembly with a soldering structure, in particular, a printed circuit board assembly with a soldering structure, wherein the assembly comprises: a plurality of electrical components; a main board on which a plurality of circuit pattern portions are formed such that the plurality of electrical components are soldered to the front surface thereof; and a solder melt which is melted after being located in at least a portion of the plurality of circuit pattern portions, and solders together the rear surfaces of the plurality of electrical components and the front surface of the main board. A solder space formation part for maintaining a solder space, which is the space between the plurality of electrical components and the main board in which the solder melt is bonded, is integrally formed in the plurality of electrical components to maintain bond flatness, thereby providing the advantage of improving assembly process reliability and filter performance.
(FR) La présente invention concerne un ensemble carte de circuit imprimé avec une structure de brasage, en particulier, un ensemble carte de circuit imprimé avec une structure de brasage, l'ensemble comprenant : une pluralité de composants électriques ; une carte principale sur laquelle une pluralité de parties de motif de circuit sont formées de telle sorte que la pluralité de composants électriques sont soudés à la surface avant de la carte principale ; et une matière fondue de brasage qui est fondue après avoir été située dans au moins une partie de la pluralité de parties de motif de circuit, et brasent ensemble les surfaces arrière de la pluralité de composants électriques et la surface avant de la carte principale. Une partie de formation d'espace de brasage destinée à maintenir un espace de brasage, qui est l'espace entre la pluralité de composants électriques et la carte principale dans laquelle la matière fondue de brasage est liée, est formée d'un seul tenant dans la pluralité de composants électriques pour conserver une planéité de liaison, ce qui permet d'obtenir l'avantage d'améliorer la fiabilité du processus d'assemblage et la performance du filtre.
(KO) 본 발명은 솔더 기판 조립체에 관한 것으로서, 특히, 다수의 전장부품, 상기 다수의 전장부품이 전면에 솔더링되도록 다수의 회로 패턴부가 형성된 메인 보드 및 상기 다수의 회로 패턴부 중 적어도 일부에 위치된 후 용융되어 상기 다수의 전장부품의 후면과 상기 메인 보드의 전면을 상호 솔더링하는 솔더 용융체를 포함하고, 상기 다수의 전장부품에는, 상기 다수의 전장부품과 상기 메인 보드 사이 공간으로써, 상기 솔더 용융체가 결합되는 솔더 공간을 유지시키는 솔더공간 형성부가 일체로 형성되어, 결합 평탄도를 유지함으로써 조립 공정 및 필터 성능의 신뢰성을 향상시키는 이점을 제공한다.
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