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1. WO2022005045 - SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD

Publication Number WO/2022/005045
Publication Date 06.01.2022
International Application No. PCT/KR2021/007327
International Filing Date 11.06.2021
IPC
H01L 21/67 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
B24B 37/013 2012.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 37/04 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
CPC
B24B 37/013
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 37/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 37/042
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
042operating processes therefor
H01L 21/67
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/67253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67253Process monitoring, e.g. flow or thickness monitoring
Applicants
  • 주식회사 케이씨텍 KCTECH CO., LTD. [KR]/[KR]
Inventors
  • 손지훈 SON, Ji Hoon
Agents
  • 특허법인 무한 MUHANN PATENT & LAW FIRM
Priority Data
10-2020-008090801.07.2020KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD
(FR) SYSTÈME DE POLISSAGE DE SUBSTRATS ET PROCÉDÉ DE POLISSAGE DE SUBSTRATS
(KO) 기판 연마 시스템 및 기판 연마 방법
Abstract
(EN) Disclosed are a substrate polishing system and a substrate polishing method. A substrate polishing system according to an embodiment comprises a plurality of polishing apparatuses which sequentially polish a substrate, wherein each of the plurality of polishing apparatuses includes: a polishing surface plate on which a substrate is polished; a data collection unit which collects signals generated in the substrate polishing process; a data analysis unit which analyzes the collected signals to detect the thickness of the substrate; and a polishing end-point detection unit which detects a polishing end-point of the substrate by using the detected thickness of the substrate, wherein the plurality of polishing apparatuses share data with each other, and data obtained from one polishing apparatus on the basis of a polishing order of the substrate may be reflected in the substrate thickness detection process of the next polishing apparatus.
(FR) Un système de polissage de substrats et un procédé de polissage de substrats sont divulgués. Un système de polissage de substrat selon un mode de réalisation comprend une pluralité d'appareils de polissage qui polissent séquentiellement un substrat, chacun des appareils de la pluralité d'appareils de polissage comprenant : une plaque de surface de polissage, sur laquelle est poli un substrat ; une unité de collecte de données, qui collecte des signaux générés lors du processus de polissage de substrat ; une unité d'analyse de données, qui analyse les signaux collectés pour détecter l'épaisseur du substrat ; et une unité de détection de points d'extrémité de polissage, qui détecte un point d'extrémité de polissage du substrat à l'aide de l'épaisseur détectée du substrat. La pluralité d'appareils de polissage partagent des données les uns avec les autres et des données obtenues à partir d'un appareil de polissage sur la base d'un ordre de polissage du substrat peuvent être reflétées lors du processus de détection d'épaisseur de substrat de l'appareil suivant de polissage.
(KO) 기판 연마 시스템 및 기판 연마 방법을 개시한다. 일 실시 예에 따른 기판 연마 시스템은 기판을 순차적으로 연마하는 복수의 연마장치를 포함하고, 상기 각각의 연마장치는 기판을 연마하는 연마정반과. 상기 기판의 연마과정에서 발생하는 신호를 수집하는 데이터수집부와, 상기 수집된 신호를 분석하여 기판의 두께를 검출하는 데이터 분석부와, 상기 검출된 기판의 두께를 통해 기판의 연마종점을 결정하는 연마종점 검출부를 포함하고, 상기 복수의 연마장치는 상호간의 데이터를 공유하고, 기판의 연마순서를 기준으로 하나의 연마장치에서 획득된 데이터는 다음 연마장치의 기판 두께 검출과정에 반영될 수 있다.
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