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1. WO2022004791 - COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME AND HEAT DISSIPATION SUBSTRATE

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Publication Number WO/2022/004791
Publication Date 06.01.2022
International Application No. PCT/JP2021/024764
International Filing Date 30.06.2021
IPC
C22C 9/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
9Alloys based on copper
C22F 1/00 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 2006.1
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08of copper or alloys based thereon
H01B 1/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
H01B 5/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
02Single bars, rods, wires or strips; Bus-bars
CPC
C22C 9/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
9Alloys based on copper
C22F 1/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08of copper or alloys based thereon
H01B 1/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
H01B 5/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
02Single bars, rods, wires, or strips
Applicants
  • 三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP]/[JP]
Inventors
  • 松永　裕隆 MATSUNAGA Hirotaka
  • 福岡　航世 FUKUOKA Kosei
  • 牧　一誠 MAKI Kazunari
  • 森川　健二 MORIKAWA Kenji
  • 船木　真一 FUNAKI Shinichi
  • 森　広行 MORI Hiroyuki
Agents
  • 松沼　泰史 MATSUNUMA Yasushi
  • 寺本　光生 TERAMOTO Mitsuo
  • 細川　文広 HOSOKAWA Fumihiro
  • 大浪　一徳 ONAMI Kazunori
Priority Data
2020-11269530.06.2020JP
2020-11292730.06.2020JP
2020-18173429.10.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME AND HEAT DISSIPATION SUBSTRATE
(FR) ALLIAGE DE CUIVRE, MATÉRIAU EN ALLIAGE DE CUIVRE TRAVAILLÉ PLASTIQUEMENT, COMPOSANT POUR APPAREIL ÉLECTRONIQUE OU ÉLECTRIQUE, BORNE, BARRE OMNIBUS, GRILLE DE CONNEXION ET SUBSTRAT DE DISSIPATION DE CHALEUR
(JA) 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板
Abstract
(EN) One embodiment of this copper alloy has a composition that contains more than 10 mass ppm but less than 100 mass ppm of Mg, with the balance being made up of Cu and unavoidable impurities; among the unavoidable impurities, the amount of S is set to 10 mass ppm or less, the amount of P is set to 10 mass ppm or less, the amount of Se is set to 5 mass ppm or less, the amount of Te is set to 5 mass ppm or less, the amount of Sb is set to 5 mass ppm or less, the amount of Bi is set to 5 mass ppm or less and the amount of As is set to 5 mass ppm or less, with the total amount of S, P, Se, Te, Sb, Bi and As being set to 30 mass ppm or less; and the mass ratio (Mg)/(S + P + Se + Te + Sb + Bi + As) is set within the range of from 0.6 to 50. This embodiment has a conductivity of 97% IACS or more and a residual stress ratio of 20% or more at 150°C in 1,000 hours.
(FR) Un mode de réalisation de cette invention concerne un alliage de cuivre contenant: plus de 10 ppm en masse et moins de 100 ppm en masse de Mg, le reste étant constitué de Cu et d'inévitables impuretés. Dans ces impuretés: la quantité de S est inférieure ou égale à 10 ppm en masse; la quantité de P est inférieure ou égale à 10 ppm en masse; la quantité de Se est inférieure ou égale à 5 ppm en masse; la quantité de Te est inférieure ou égale à 5 ppm en masse; la quantité de Sb est inférieure ou égale à 5 ppm en masse; la quantité de Bi est inférieure ou égale à 5 ppm en masse; et la quantité de As est inférieure ou égale à 5 ppm en masse; la quantité totale de S, P, Se, Te, Sb, Bi et As étant inférieure ou égale à 30 ppm en masse. Pour cet alliage, le rapport de masse (Mg) / (S+P+Se+Te+Sb+Bi+As) est compris entre 0,6 et 50; la conductivité est supérieure ou égale à 97% IACS; et le taux de contrainte résiduelle à 150℃ et 1000 heures, est supérieur ou égal à 20%.
(JA) この銅合金の一態様は、１０ｍａｓｓｐｐｍ超え１００ｍａｓｓｐｐｍ未満のＭｇを含み、残部がＣｕ及び不可避不純物であり、不可避不純物のうち、Ｓ量が１０ｍａｓｓｐｐｍ以下、Ｐ量が１０ｍａｓｓｐｐｍ以下、Ｓｅ量が５ｍａｓｓｐｐｍ以下、Ｔｅ量が５ｍａｓｓｐｐｍ以下、Ｓｂ量が５ｍａｓｓｐｐｍ以下、Ｂｉ量が５ｍａｓｐｐｍ以下、Ａｓ量が５ｍａｓｐｐｍ以下、ＳとＰとＳｅとＴｅとＳｂとＢｉとＡｓの合計量が３０ｍａｓｓｐｐｍ以下、質量比〔Ｍｇ〕／〔Ｓ＋Ｐ＋Ｓｅ＋Ｔｅ＋Ｓｂ＋Ｂｉ＋Ａｓ〕が０．６～５０、導電率が９７％ＩＡＣＳ以上、残留応力率が１５０℃、１０００時間で２０％以上である。
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