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1. WO2022004772 - OPTICAL MODULE

Publication Number WO/2022/004772
Publication Date 06.01.2022
International Application No. PCT/JP2021/024696
International Filing Date 30.06.2021
IPC
H01L 31/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
G02B 6/42 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
H01S 5/02234 2021.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02218Material of the housings; Filling of the housings
02234Resin-filled housings; the housings being made of resin
H01S 5/02255 2021.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0225Out-coupling of light
02255using beam deflecting elements
Applicants
  • 日東電工株式会社 NITTO DENKO CORPORATION [JP]/[JP]
Inventors
  • 鈴木 一聡 SUZUKI Kazuaki
  • 古根川 直人 KONEGAWA Naoto
  • 大川 忠男 OKAWA Tadao
  • 一ノ瀬 幸史 ICHINOSE Koji
Agents
  • 西藤 征彦 SAITOH Yukihiko
  • 井▲崎▼ 愛佳 IZAKI Aika
  • 西藤 優子 SAITO Yuko
Priority Data
2020-11385701.07.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) OPTICAL MODULE
(FR) MODULE OPTIQUE
(JA) 光モジュール
Abstract
(EN) Disclosed is an optical module comprising: an electric circuit board (E) having an electric circuit provided on a light-transmissive resin substrate (1); and an optical element (11) joined on the electric circuit board (E). The optical module is configured such that: the optical element (11) is joined to the electric circuit board (E) in a state where a light-emitting unit or a light-receiving unit (11a) of the optical element (11) faces an electric circuit surface side of the electric circuit board (E); a light-transmissive resin cured product (X) is embedded between the light-emitting unit or the light-receiving unit (11a) of the optical element (11) and the light-transmissive resin substrate (1); and the relative refractive index difference between the light-transmissive resin cured product (X) and the light-transmissive resin substrate (1) is 20% or less. In this way, light propagation loss can be reduced with a simple structure.
(FR) Un module optique est divulgué, comprenant : une carte de circuit électrique (E) ayant un circuit électrique disposé sur un substrat de résine transmettant la lumière (1) ; et un élément optique (11) assemblé sur la carte de circuit électrique (E). Le module optique est configuré de telle sorte que : l'élément optique (11) est relié à la carte de circuit électrique (E) dans un état dans lequel une unité électroluminescente ou une unité de réception de lumière (11a) de l'élément optique (11) fait face à un côté de surface de circuit électrique de la carte de circuit électrique (E) ; un produit durci à base de résine transmettant la lumière (X) est intégré entre l'unité électroluminescente ou l'unité de réception de lumière (11a) de l'élément optique (11) et le substrat de résine transmettant la lumière (1) ; et la différence d'indice de réfraction relatif entre le produit durci à base de résine transmettant la lumière (X) et le substrat de résine transmettant la lumière (1) est de 20 % ou moins. De cette manière, la perte de propagation de lumière peut être réduite avec une structure simple.
(JA) 光透過性樹脂基板(1)上に電気回路が設けられた電気回路基板(E)と、電気回路基板(E)上に接合された光素子(11)とを備えた光モジュールであって、光素子(11)が、光素子(11)の発光部または受光部(11a)を、電気回路基板(E)の電気回路面側に向けた状態で電気回路基板(E)と接合され、光素子(11)の発光部または受光部(11a)と、光透過性樹脂基板(1)との間が、光透過性樹脂硬化物(X)で埋められており、光透過性樹脂硬化物(X)と光透過性樹脂基板(1)の比屈折率差が20%以下である光モジュールとする。これにより、簡素な構造で光の伝播損失を小さくすることができる。
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