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1. WO2022004758 - SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Publication Number WO/2022/004758
Publication Date 06.01.2022
International Application No. PCT/JP2021/024649
International Filing Date 29.06.2021
IPC
H01L 23/28 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 23/29 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 25/07 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants
  • 富士電機株式会社 FUJI ELECTRIC CO., LTD. [JP]/[JP]
Inventors
  • 齊藤 まい SAITOU Mai
  • 岩谷 昭彦 IWAYA Akihiko
  • 中村 瑶子 NAKAMURA Yoko
  • 浅井 竜彦 ASAI Tatsuhiko
  • 郷原 広道 GOHARA Hiromichi
  • 渡壁 翼 WATAKABE Tsubasa
  • 佐藤 成実 SATO Narumi
Agents
  • 龍華国際特許業務法人 RYUKA IP LAW FIRM
Priority Data
2020-11356230.06.2020JP
2020-18310230.10.2020JP
2021-03945311.03.2021JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
(FR) MODULE SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE MODULE SEMI-CONDUCTEUR
(JA) 半導体モジュールおよび半導体モジュールの製造方法
Abstract
(EN) Provided is a semiconductor module comprising: an insulating circuit board that has a circuit pattern formed on one surface thereof; a semiconductor chip that is mounted on the insulating circuit board; and a wiring section that electrically connects the semiconductor chip and the circuit pattern, wherein the wiring section has a chip-connecting section that connects to the semiconductor chip, and the surface of the chip-connecting section has a plurality of recessed sections and a flat surface section which is positioned between two of the recesses.
(FR) La présente invention concerne un module semi-conducteur comprenant : une carte de circuit imprimé isolante sur une surface de laquelle est formé un motif de circuit ; une puce semi-conductrice qui est montée sur la carte de circuit imprimé isolante ; et une section de câblage qui connecte électriquement la puce semi-conductrice et le motif de circuit, la section de câblage comprenant une section de connexion de puce qui se connecte à la puce semi-conductrice, et la surface de la section de connexion de puce comprenant une pluralité de sections renfoncées et une section de surface plate qui est positionnée entre deux des renfoncements.
(JA) 一方の面に回路パターンが形成された絶縁回路基板と、絶縁回路基板に載置された半導体チップと、半導体チップおよび回路パターンを電気的に接続する配線部とを備え、配線部は、半導体チップと接続するチップ接続部を有し、チップ接続部の表面は、複数の凹部と、2つの凹部の間に配置された平面部とを有する半導体モジュールを提供する。
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