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1. WO2022004600 - PRINTED WIRING BOARD SUBSTRATE, AND MULTILAYER SUBSTRATE

Publication Number WO/2022/004600
Publication Date 06.01.2022
International Application No. PCT/JP2021/024173
International Filing Date 25.06.2021
IPC
B32B 27/20 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
20using fillers, pigments, thixotroping agents
B32B 27/30 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
30comprising vinyl resin; comprising acrylic resin
B32B 15/082 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
082comprising vinyl resins; comprising acrylic resins
B32B 15/18 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
18comprising iron or steel
H05K 1/03 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
Applicants
  • 住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP]/[JP]
  • 住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP]/[JP]
Inventors
  • 岩崎 迅希 IWASAKI Toshiki
  • 中林 誠 NAKABAYASHI Makoto
  • 木谷 聡志 KIYA Satoshi
Agents
  • 森田 剛史 MORITA Takeshi
  • 伊倉 恒生 IKURA Tsuneo
  • 緒方 大介 OGATA Daisuke
  • 高城 政浩 TAKAGI Masahiro
  • 久貝 裕一 KUGAI Hirokazu
Priority Data
2020-11345030.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRINTED WIRING BOARD SUBSTRATE, AND MULTILAYER SUBSTRATE
(FR) SUBSTRAT DE CARTE DE CIRCUIT IMPRIMÉ, ET SUBSTRAT MULTICOUCHE
(JA) プリント配線板用基板及び多層基板
Abstract
(EN) A printed wiring board substrate according to one embodiment is provided with: a base material layer; and a copper foil which is laminated, directly or indirectly, over at least some part of one or both surfaces of the base material layer. The base material layer includes a matrix consisting mainly of a fluororesin and one or a plurality of reinforcing material layers included in the matrix. When the average thickness of the base material layer is represented by A, and the average distance between the copper foil surface facing the matrix, and the reinforcing material layer surface closest to said surface and facing the copper foil is represented by B, the ratio B/A is 0.003 to 0.37.
(FR) Un substrat de carte de circuit imprimé, selon un mode de réalisation, est doté : d'une couche de matériau de base ; et d’une feuille de cuivre qui est stratifiée, directement ou indirectement, sur au moins une partie d'une ou des deux surfaces de la couche de matériau de base. La couche de matériau de base comprend une matrice constituée principalement d'une résine fluorée et d'une ou de plusieurs couches de matériau de renforcement comprises dans la matrice. Lorsque l'épaisseur moyenne de la couche de matériau de base est représentée par A, et que la distance moyenne entre la surface de feuille de cuivre faisant face à la matrice, et la surface de couche de matériau de renforcement la plus proche de ladite surface et faisant face à la feuille de cuivre est représentée par B, le rapport B/A est de 0,003 à 0,37.
(JA) 本開示の一態様に係るプリント配線板用基板は、基材層と、前記基材層の片面又は両面の少なくとも一部に直接的又は間接的に積層された銅箔とを備え、前記基材層がフッ素樹脂を主成分とするマトリックス及びこのマトリックス中に含まれる1又は複数の補強材層を有し、前記基材層の平均厚さをAとし、前記銅箔の前記にマトリックス対向する表面と前記表面に最も近い前記補強材層の前記銅箔に対向する表面との平均距離をBとしたとき、比B/Aが0.003以上0.37以下である。
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