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1. WO2022004589 - TERMINAL MEMBER, ASSEMBLY, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFACTURING SAME

Publication Number WO/2022/004589
Publication Date 06.01.2022
International Application No. PCT/JP2021/024120
International Filing Date 25.06.2021
IPC
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50for integrated circuit devices
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01R 43/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02for soldered or welded connections
H01R 43/16 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
16for manufacturing contact members, e.g. by punching and by bending
Applicants
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP]
Inventors
  • ▲謝▼ 崇▲発▼ XIE, Chongfa
  • 石井 隆一 ISHII, Ryuichi
  • 三井 貴夫 MITSUI, Takao
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
2020-11265130.06.2020JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) TERMINAL MEMBER, ASSEMBLY, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFACTURING SAME
(FR) ÉLÉMENT DE BORNE, ENSEMBLE, DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉS DE FABRICATION ASSOCIÉS
(JA) 端子部材、集合体、半導体装置およびこれらの製造方法
Abstract
(EN) The present invention improves workability during a semiconductor device manufacturing process. Provided is a terminal member (5) that bonds to an electrode of a semiconductor element, the terminal member (5) comprising a conductor portion (50), a first annular projecting portion (53), and an annular recessed portion (58). The conductor portion (50) includes a first main surface (50a) and a second main surface (50b) positioned on a side opposite the first main surface (50a). The first annular projecting portion (53) is formed on the first main surface (50a) of the conductor portion (50). The annular recessed portion (58) is formed in the second main surface, and is disposed in a position overlapping the first annular projecting portion (53). By pressing a bonding member (4) onto the first main surface (50a) of the terminal member (5), a state in which the first annular projecting portion (53) is embedded in the bonding member (4) can be obtained.
(FR) La présente invention améliore l'ouvrabilité pendant un procédé de fabrication de dispositif à semi-conducteur. L'invention concerne un élément de borne (5) qui se lie à une électrode d'un élément semi-conducteur, l'élément de borne (5) comprenant une partie conductrice (50), une première partie saillante annulaire (53) et une partie évidée annulaire (58). La partie conductrice (50) comporte une première surface principale (50a) et une seconde surface principale (1b) qui se trouve sur l'envers de la première surface principale (50a). La première partie saillante annulaire (53) est formée sur la première surface principale (50a) de la partie conductrice (50). La partie évidée annulaire (58) est formée dans la seconde surface principale, et est disposée dans une position chevauchant la première partie saillante annulaire (53). En pressant un élément de liaison (4) sur la première surface principale (50a) de l'élément de borne (5), un état dans lequel la première partie saillante annulaire (53) est incorporée dans l'élément de liaison (4) peut être obtenu.
(JA) 半導体装置の製造工程における作業性を向上させる。端子部材(5)は、半導体素子の電極に接合される端子部材(5)であって、導体部(50)と第1環状突起部(53)と、環状凹部(58)とを備える。導体部(50)は第1主面(50a)と、第1主面(50a)と反対側に位置する第2主面(50b)とを有する。第1環状突起部(53)は、導体部(50)の第1主面(50a)に形成される。環状凹部(58)は、第2主面に形成され、第1環状突起部(53)と重なる位置に配置されている。端子部材(5)の第1主面(50a)に接合部材(4)を押圧することで、第1環状突起部(53)が接合部材(4)に埋め込まれた状態とすることができる。
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